Datasheet

®
INA101
3
PIN CONFIGURATIONS
Top View
10
1
5
3
4
–In
+In
Gain
Set
Offset
Adjust
Offset
Adjust
Gain Set
2
9
8
7
6
–V
CC
Common
Output
+V
CC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Output
+V
CC
–Input
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
Common
–V
CC
+Input
Gain Sense 2
Gain Set 2
A2 Output
A1 Output
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Output
+V
CC
–Input
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
NC
Common
–V
CC
+Input
Gain Sense 2
Gain Set 2
A2 Output
A1 Output
NC
DIP
G and P Package
SOIC
U Package
TO-100
M Package
ORDERING INFORMATION
PRODUCT PACKAGE TEMPERATURE RANGE
INA101AM 10-Pin Metal TO-100 –25°C to +85°C
INA101CM 10-Pin Metal TO-100 –25°C to +85°C
INA101AG 14-Pin Ceramic DIP –25°C to +85°C
INA101CG 14-Pin Ceramic DIP –25°C to +85°C
INA101HP 14-Pin Plastic DIP 0°C to +70°C
INA101KU SOL-16 Surface-Mount 0°C to +70°C
INA101SG 14-Pin Ceramic DIP –55°C to +125°C
INA101SM 10-Pin Metal TO-100 –55°C to +125°C
ABSOLUTE MAXIMUM RATINGS
Supply Voltage ................................................................................... ±20V
Power Dissipation .......................................................................... 600mW
Input Voltage Range .......................................................................... ±V
CC
Output Short Circuit (to ground) ............................................... Continuous
Operating Temperature M, G Package ........................... –55°C to +125°C
P, U Package ................................................................. –25°C to +85°C
Storage Temperature M, G Package .............................. –65°C to +150°C
P, U Package ................................................................. –40°C to +85°C
Lead Temperature (soldering, 10s) M, G, P Package ................... +300°C
Lead Temperature (wave soldering, 3s) U Package...................... +260°C
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER
(1)
INA101AM 10-Pin Metal TO-100 007
INA101CM 10-Pin Metal TO-100 007
INA101AG 14-Pin Ceramic DIP 169
INA101CG 14-Pin Ceramic DIP 169
INA101HP 14-Pin Plastic DIP 010
INA101KU SOL-16 Surface-Mount 211
INA101SG 14-Pin Ceramic DIP 169
INA101SM 10-Pin Metal TO-100 007
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.