Datasheet

Microprocessor
Chipset
Memory/GPU
Hub
iGPU
Chipset
I/O Hub
HD3SS3412
HD3SS3412HD3SS3412HD3SS3412
x16
Port A
x2
x8
x16 Graphics Card Slot
x8 Graphics Card Slot
Port B
x2
Port B
x2
Port B
x2
Port B
x2
Port C
x2
Port C
x2
Port C
x2
Port C
x2
SEL Pins
GPIO
HD3SS3412
SLAS828B –FEBRUARY 2012–REVISED NOVEMBER 2013 www.ti.com
TYPICAL APPLICATION
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN MAX
Supply voltage range (V
DD
) Absolute minimum/maximum supply voltage range –0.5 4 V
Differential I/O –0.5 4
Voltage range V
Control pin (SEL) –0.5 VDD + 0.5
Human body model
(3)
±4000
Electrostatic discharge V
Charged-device model
(4)
±1500
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential voltages, are with respect to network ground terminal.
(3) Tested in accordance with JEDEC/ESDA JS-001-2011
(4) Tested in accordance with JEDEC JESD22 C101-E
THERMAL INFORMATION
HD3SS3412
THERMAL METRIC
(1)
UNITS
42-PIN TQFN (RUA)
θ
JA
Junction-to-ambient thermal resistance 53.8
θ
JCtop
Junction-to-case (top) thermal resistance 38.2
θ
JCbot
Junction-to-case (bottom) thermal resistance 21.9
°C/W
θ
JB
Junction-to-board thermal resistance 27.4
ψ
JT
Junction-to-top characterization parameter 5.6
ψ
JB
Junction-to-board characterization parameter 27.3
Device Power Dissipation (P
D
) 15.5 (Typ)
mW
21.6 (Max)
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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