Datasheet

FPD-Link Evaluation Kit User’s Manual
National Semiconductor Corporation
Rev 3.0
Date: 9/25/2007
Page 16 of 25
BOM (Bill of Materials) Receiver PCB:
HSL Demo Board Schematic REV3
HSL8RXR3 Revision: 3 FPD-Link
Item Qty Reference Part Pkg Size
1 1 C1
10 µF
CASE D
2 4 C2,C6,C10,C14
0.1 µF
1206 (3216)
3 4 C3,C7,C11,C15
22 µF
7343 (D)
4 3 C4,C8,C12
0.001 µF
0805 (2012)
5 3 C5,C9,C13
0.01 µF
0805 (2012)
6 1 JP1 3_PIN_HEADER 0.1" spacing
7 1 J1 IDC30X2 IDC60
8 1 J2 IDC10X2 IDC20
9 29 R1,R2,R3,R4,R5,R6,R7,R8, Optional 0402
R9,R10,R11,R12,R13,R14, (See previous page)
R15,R16,R17,R18,R19,R20,
R21,R22,R23,R24,R25,R26,
R27,R28,R29
10 6 R35,R36,R37,R38,R39,R40 0 Ohm 0402
11 5 R30,R31,R32,R33,R34 100 Ohm 0402
12 2 TP1,TP2 N/A TP_.2"X.2"
13 1 U1 DS90CF386MTD 56-pin TSSOP