Datasheet

Stellaris® LM3S1968 Evaluation Board
January 6, 2010 27
I/O Breakout Pads
The LM3S1968 EVB has 58 I/O pads, 13 power pads, and 1 control connection, for a total of 71
pads. Connection can be made by soldering wires directly to these pads, or by using 0.1” pitch
headers and sockets.
Note: In Table B-1, an asterisk (*) by a signal name (also on the EVB PCB) indicates the signal is
normally used for on-board functions. Normally, you should cut the associated jumper (JP1-15)
before using an assigned signal for external interfacing.
Table B-1. I/O Breakout Pads
Description
Pad
No.
Description
Pad
No.
Description
Pad
No.
Description
Pad
No.
PB4/C0- 1 PB1/CCP2 18 PA6/I2C1SCL 35 PG3* 52
GND 2 PB0/CCP0 19 PA7/I2C1SDA 36 PD1/PWM1 53
PB5/C1- 3 GND 20 PA4/SSI0RX 37 PD2/U1RX 54
PB6/C0+ 4 PF1/IDX1 21 PA5/SSI0TX* 38 GND 55
PB7/TRST 5 PF2/PWM4 22 PA2/SSI0CLK* 39 PD0/IDX0 56
PH0/PWM2* 6 PF3/PWM5 23 PA3/SSI0FSS* 40 ADC3 57
PH1/PWM3* 7 PF4/C0O 24 PA0/U0RX* 41 GND 58
PH2* 8 HIBn 25 PA1/U0TX* 42 ADC1 59
PH3/FAULT* 9 PF0/PHB0 26 PC4/PhA0 43 ADC2 60
PC2/TDI 10 PF5 27 GND 44 ADC4 61
PC3/TDO/SWO 11 PF6/CCP1 28 PC6/C2+ 45 ADC0 62
PE3/SSI1TX 12 PF7 29 PC5/C1+ 46 ADC6 63
PE2/SSI1RX 13 PG4* 30 PG0/U2RX 47 ADC5 64
PE1/SSI1FSS 14 PG5* 31 PC7/C2- 48 GND 65
PE0/SSI1CLK 15 GND 32 PG2/PWM0* 49 ADC7 66
PB3/I2C0SDA 16 PG7/PHB1* 33 PG1/U2TX 50
PB2/I2C0SCL 17 PG6/PHA1* 34 PD3/U1TX 51