Datasheet
OUT-
OUT+
EN
IN-
IN+
GND
IN-
IN+
N/C
EN
OUT-
OUT+
VCC
1
2
3
4
8
6
5
7
GND
DAP
GND
IN-
IN+
N/C
EN
OUT-
OUT+
VCC
1
2
3
4
8
6
5
7
DS92001
www.ti.com
SNLS147F –JUNE 2002–REVISED APRIL 2013
DS92001 3.3V B/LVDS-BLVDS Buffer
Check for Samples: DS92001
1
FEATURES
DESCRIPTION
The DS92001 B/LVDS-BLVDS Buffer takes a BLVDS
2
• Single +3.3 V Supply
input signal and provides a BLVDS output signal. In
• Receiver Inputs Accept LVDS/CML/LVPECL
many large systems, signals are distributed across
Signals
backplanes. One of the limiting factors for system
• TRI-STATE Outputs
speed is the "stub length" or the distance between
the transmission line and the unterminated receivers
• Receiver Input Threshold < ±100 mV
on individual cards. Although it is generally
• Fast Propagation Delay of 1.4 ns (typ)
recognized that this distance should be as short as
• Low Jitter 400 Mbps Fully Differential Data
possible to maximize system performance, real-world
Path
packaging concerns often make it difficult to make the
stubs as short as the designer would like.
• Compatible with BLVDS 10-bit SerDes (40MHz)
The DS92001 has edge transitions optimized for
• Compatible with ANSI/TIA/EIA-644-A LVDS
multidrop backplanes where the switching frequency
Standard
is in the 200 MHz range or less. The output edge rate
• Available in SOIC and Space Saving WSON
is critical in some systems where long stubs may be
Package
present, and utilizing a slow transition allows for
• Industrial Temperature Range
longer stub lengths.
The DS92001, available in the WSON package, will
allow the receiver inputs to be placed very close to
the main transmission line, thus improving system
performance.
A wide input dynamic range allows the DS92001 to
receive differential signals from LVPECL, CML as
well as LVDS sources. This will allow the device to
also fill the role of an LVPECL-BLVDS or CML-
BLVDS translator.
Connection and Block Diagrams
Figure 1. SOIC Package Number D0008A Figure 2. WSON Package Number NGK0008A
Top View Top View
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2002–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.