Datasheet

POWER SUPPLY CURRENT (mA)
350
0
BIT DATA RATE (Gbps)
50
100
150
200
250
300
PRBS-23
Clock
0 0.25 0.5
0.75
1.0
DS90LV804
SNLS195L –SEPTEMBER 2005–REVISED APRIL 2013 www.ti.com
Typical Performance Characteristics
A. Dynamic power supply current was measured while running a clock or PRBS 2
23
-1 pattern with all 4 channels active. V
CC
= 3.3V, T
A
=
+25°C, V
ID
= 0.5V, V
CM
= 1.2V
Figure 6. Power Supply Current vs Bit Data Rate
PACKAGING INFORMATION
The Leadless Leadframe Package (WQFN) is a leadframe based chip scale package (CSP) that may enhance
chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting. The
small size and very low profile make this package ideal for high density PCBs used in small-scale electronic
applications such as cellular phones, pagers, and handheld PDAs. The WQFN package is offered in the no
Pullback configuration. In the no Pullback configuration the standard solder pads extend and terminate at the
edge of the package. This feature offers a visible solder fillet after board mounting.
The WQFN has the following advantages:
• Low thermal resistance
• Reduced electrical parasitics
• Improved board space efficiency
• Reduced package height
• Reduced package mass
For more details about WQFN packaging technology, refer to applications note AN-1187, "Leadless Leadframe
Package".
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