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DS90C402

www.ti.com

SNLS001C –JUNE 1998–REVISED APRIL 2013

DS90C402 Dual Low Voltage Differential Signaling (LVDS) Receiver

Check for Samples: DS90C402

FEATURES

DESCRIPTION

The DS90C402 is a dual receiver device optimized

• Ultra Low Power Dissipation

for high data rate and low power applications. This

• Operates above 155.5 Mbps

device along with the DS90C401 provides a pair chip

• Standard TIA/EIA-644

solution for a dual high speed point-to-point interface.

The device is in a PCB space saving 8 lead small

• 8 Lead SOIC Package saves PCB space

outline package. The receiver offers ±100 mV

• V

±1V center around 1.2V

threshold sensitivity, in addition to common-mode

• ±100 mV Receiver Sensitivity

noise protection.

Connection Diagram

See Package Number D (SOIC)

Functional Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (14 pages)

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DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 DS90C402 Dual Low Voltage Differential Signaling (LVDS) Receiver Check for Samples: DS90C402 FEATURES DESCRIPTION • • • • • • The DS90C402 is a dual receiver device optimized for high data rate and low power applications. This device along with the DS90C401 provides a pair chip solution for a dual high speed point-to-point interface. The device is in a PCB space saving 8 lead small outline package.
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DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) −0.3V to (VCC + 0.3V) Input Voltage (RIN+, RIN−) −0.3V to (VCC + 0.3V) Output Voltage (ROUT) D Package Maximum Package Power Dissipation @ +25°C 1025 mW Derate D Package 8.2 mW/°C above +25°C −65°C to +150°C Storage Temperature Range Lead Temperature Range Soldering (4 sec.) +260°C Maximum Junction Temperature +150°C ESD Rating (3) ≥ 3,500V (HBM, 1.
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DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics VCC = +5.0V ± 10%, TA = −40°C to +85°C (1) (2) (3) (4) (5) Symbol Parameter Conditions CL = 5 pF, VID = 200 mV (Figure 1 and Figure 2) Min Typ Max Units 1.0 3.40 6.0 ns 1.0 3.48 6.0 ns tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD − tPLHD| 0 0.08 1.2 ns tSK1 Channel-to-Channel Skew (3) 0 0.6 1.
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DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com TYPICAL APPLICATION Figure 3. Point-to-Point Application Applications Information LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as is shown in Figure 3. This configuration provides a clean signaling environment for the quick edge rates of the drivers.
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DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 PIN DESCRIPTIONS Pin No.
PAGE 6
DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 6 Output High Voltage vs Power Supply Voltage Output High Voltage vs Ambient Temperature Figure 4. Figure 5. Output Low Voltage vs Power Supply Voltage Output Low Voltage vs Ambient Temperature Figure 6. Figure 7. Output Short Circuit Current vs Power Supply Voltage Output Short Circuit Current vs Ambient Temperature Figure 8. Figure 9.
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DS90C402 www.ti.com SNLS001C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Differential Propagation Delay vs Power Supply Voltage Differential Propagation Delay vs Ambient Temperature Figure 10. Figure 11. Differential Skew vs Power Supply Voltage Differential Skew vs Ambient Temperature Figure 12. Figure 13. Transition Time vs Power Supply Voltage Transition Time vs Ambient Temperature Figure 14. Figure 15.
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DS90C402 SNLS001C – JUNE 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS90C402MX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 DS90C402MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 11-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS90C402MX SOIC D 8 2500 367.0 367.0 35.0 DS90C402MX/NOPB SOIC D 8 2500 367.0 367.0 35.
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