Datasheet

www.ti.com
PACKAGE OUTLINE
C
54X
0.3
0.2
3.51±0.1
50X 0.5
54X
0.5
0.3
0.8 MAX
2X
8.5
7.5±0.1
2X 4
A
10.1
9.9
B
5.6
5.4
0.3
0.2
0.5
0.3
(0.1)
4214993/A 07/2013
WQFNNJY0054A
WQFN
PIN 1 INDEX AREA
SEATING PLANE
1
18
28
45
19
27
54
46
0.1 C A B
0.05 C
(OPTIONAL)
PIN 1 ID
DETAIL
SEE TERMINAL
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 2.000
DETAIL
OPTIONAL TERMINAL
TYPICAL