Datasheet

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DS36C200

www.ti.com

SNLS111D –JUNE 1998–REVISED APRIL 2013

DS36C200 Dual High Speed Bi-Directional Differential Transceiver

Check for Samples: DS36C200

FEATURES

DESCRIPTION

The DS36C200 is a dual transceiver device optimized

• Optimized for DSS to DVHS Interface Link

for high data rate and low power applications. This

• Compatible IEEE 1394 Signaling Voltage

device provides a single chip solution for a dual high

Levels

speed bi-directional interface. Also, both control pins

• Operates Above 100 Mbps

may be routed together for single bit control of

datastreams. Both control pins are adjacent to each

• Bi-directional Transceivers

other for ease of routing them together. The

• 14-lead SOIC Package

DS36C200 is compatible with IEEE 1394 physical

• Ultra Low Power Dissipation

layer and may be used as an economical solution

with some considerations. Please reference the

• ±100 mV Receiver Sensitivity

application information on 1394 for more information.

• Low Differential Output Swing Typical 210 mV

The device is in a 14-lead small outline package. The

• High Impedance During Power Off

differential driver outputs provides low EMI with its

low output swings typically 210 mV. The receiver

offers ±100 mV threshold sensitivity, in addition to

common-mode noise protection.

Connection Diagram

Note: * denotes active LOW pin

Figure 1. SOIC Package

See Package Number D (R-PDSO-G14)

Functional Diagram

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (16 pages)

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DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 DS36C200 Dual High Speed Bi-Directional Differential Transceiver Check for Samples: DS36C200 FEATURES DESCRIPTION • • The DS36C200 is a dual transceiver device optimized for high data rate and low power applications. This device provides a single chip solution for a dual high speed bi-directional interface. Also, both control pins may be routed together for single bit control of datastreams.
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DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3V to +6V Supply Voltage (VCC) Enable Input Voltage −0.3V to (VCC + 0.3V) (DE, RE*) Voltage (DI/RO) −0.3V to +5.9V Voltage (DO/RI±) −0.3V to +5.
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DS36C200 www.ti.
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DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Switching Characteristics Over supply voltage and operating temperature ranges, unless otherwise specified. Symbol Parameter (1) (2) Conditions Min Typ Max Units RL = 55Ω, CL = 10 pF (Figure 3 and Figure 4) 1.0 2.5 5.5 ns 1.0 2.6 5.5 ns DIFFERENTIAL DRIVER CHARACTERISTICS tPHLD Differential Propagation Delay High to Low tPLHD Differential Propagation Delay Low to High tSKD Differential Skew |tPHLD – tPLHD| 0 0.
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DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 PARAMETER MEASUREMENT INFORMATION Figure 2. Differential Driver DC Test Circuit Figure 3. Differential Driver Propagation Delay and Transition Time Test Circuit Figure 4. Differential Driver Propagation Delay and Transition Time Waveforms Figure 5.
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DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 6. Driver TRI-STATE Delay Waveforms Figure 7. Receiver Propagation Delay and Transition Time Test Circuit Figure 8. Receiver Propagation Delay and Transition Time Waveforms Figure 9. Receiver TRI-STATE Delay Test Circuit Figure 10.
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DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 APPLICATION INFORMATION TRUTH TABLES The DS36C200 has two enable pins DE and RE*, however, the driver and receiver should never be enabled simultaneously. Enabling both could cause multiple channel contention between the receiver output and the driving logic. It is recommended to route the enables together on the PC board. This will allow a single bit [DE/RE*] to control the chip.
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DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com DEVICE PIN DESCRIPTIONS Pin# Name Mode Description (In mode only) 3 DE 1, 7 DI 10, 13 DO+ 11, 12 DO− 4 RE* Transmit Driver Enable: When asserted low driver is disabled. And when asserted high driver is enabled. TTL/CMOS driver input pins Non-inverting driver output pin Inverting driver output pin Receive Receiver Enable: When asserted low receiver is enabled. And when asserted high receiver is disabled.
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DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 Fail-safe Feature: The LVDS receiver is a high gain, high speed device that amplifies a small differential signal (20mV) to CMOS logic levels. Due to the high gain and tight threshold of the receiver, care should be taken to prevent noise from appearing as a valid signal.
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DS36C200 SNLS111D – JUNE 1998 – REVISED APRIL 2013 www.ti.com Figure 12. Typical in Home Application Figure 13. Typical Interface Connection (1) 10 (1) The DS36C200 is a current mode device and only function with datasheet specification when a resistive load is applied to the drivers outputs.
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DS36C200 www.ti.com SNLS111D – JUNE 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision C (April 2013) to Revision D • Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device DS36C200MX/NOPB Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.5 B0 (mm) K0 (mm) P1 (mm) 9.35 2.3 8.0 W Pin1 (mm) Quadrant 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS36C200MX/NOPB SOIC D 14 2500 367.0 367.0 35.
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