Datasheet
DS32EL0124, DS32ELX0124
SNLS284K –MAY 2008–REVISED APRIL 2013
www.ti.com
LVCMOS Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. Applies to LT_EN, GPIO0, GPIO1,
GPIO2, RX_MUX_SEL, DC_B, RESET, RS, LOCK.
(1) (2) (3)
Symbol Parameter Conditions Min Typ Max Units
V
IH
High Level Input Voltage 2.0 V
DD
V
V
IL
Low Level Input Voltage GND 0.8 V
V
OH
High Level Output Voltage I
OH
= -2mA 2.7 3.2 V
V
OL
Low Level Output Voltage I
OL
= 2mA 0.3V V
V
CL
Input Clamp Voltage I
CL
= −18 mA -0.9 −1.5 V
I
IN
Input Current V
IN
= 0.4V, 2.5V, or V
DD33
-40 40 μA
I
OS
Output Short Circuit Current V
OUT
= 0V -45 mA
(4)
(1) The Electrical and Timing Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except
as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only
and are not ensured.
(2) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except V
OD
and ΔV
OD
.
(3) Typical values represent most likely parametric norms for V
CC
= +3.3V and T
A
= +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(4) Output short circuit current (I
OS
) is specified as magnitude only, minus sign indicates direction only.
SMBus Electrical Specifications
Over recommended operating supply and temperature ranges unless otherwise specified.
(1) (2)
Symbol Parameter Conditions Min Typ Max Units
V
SIL
Data, Clock Input Low Voltage 0.8 V
V
SIH
Data, Clock Input High Voltage 2.1 V
SDD
V
V
SDD
Nominal Bus Voltage 2.375 3.465 V
I
SLEAKB
Input Leakage Per Bus Segment SCK and SDA pins ±200 µA
I
SLEAKP
Input Leakage Per Pin ±10 µA
C
SI
Capacitance for SDA and SCK 10 pF
(1) The Electrical and Timing Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except
as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only
and are not ensured.
(2) Typical values represent most likely parametric norms for V
CC
= +3.3V and T
A
= +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
SMBus Timing Specifications
Over recommended operating supply and temperature ranges unless otherwise specified.
(1) (2)
Symbol Parameter Conditions Min Typ Max Units
f
SMB
Bus Operating Frequency 10 100 kHz
t
BUF
Bus free time between top and start condition 4.7 μs
t
HD:STA
Hold time after (repeated) start condition. After this 4.0 µs
period, the first clock is generated
t
SU:STA
Repeated Start Condition Setup Time
(3)
4.7 µs
t
HD:DAT
Data Hold Time 300 ns
t
SU:DAT
Data Setup Time
(3)
250 ns
t
LOW
Clock Low Time 4.7 µs
t
HIGH
Clock High Time 4.0 50 µs
t
SU:CS
SMB_CS Setup Time
(3)
30 ns
(1) The Electrical and Timing Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except
as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only
and are not ensured.
(2) Typical values represent most likely parametric norms for V
CC
= +3.3V and T
A
= +25°C, and at the Recommended Operation Conditions
at the time of product characterization and are not ensured.
(3) Parameter is specified by characterization and is not tested at production.
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