Datasheet

DS26C32AM, DS26C32AT
SNLS382C –JUNE 1998–REVISED APRIL 2013 www.ti.com
Connection Diagrams
Top View
For Complete Military Product Specifications, refer to the appropriate SMD or MDS.
Figure 1. PDIP Package
See Package Number D0016A or NFG0016E
See Package Number NAJ0020A, NFE0016A or NAD0016A
Top View
Figure 2. 20-Lead Ceramic Leadless Chip Carrier
LCCC Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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