Datasheet
INA+
INA-
OUTB+
VDD_SEL
VIN
18
INB+
INB-
17
14
13
16
LOS
VOD_SEL / READEN#
MODE / DONE#
SD_TH
OUTA+
OUTA-
OUTB-
SMBUS AND
CONTROL
15
VDD
24
23
22
21
20
19
11
12
8
10
9
7
EQB1/AD2
ENSMB
1
2
5
6
3
SCL/DEMB
EQB0/AD3
SDA/DEMA
4
VDD
TX_DIS
AD1/EQA1
AD0/EQA0
DS100BR111
www.ti.com
SNLS338E –JANUARY 2011–REVISED FEBRUARY 2013
Pin Diagram
(1) The center DAP on the package bottom is the device GND connection. This pad must be connected to GND through
multiple (minimum of 4) vias to ensure optimal electrical and thermal performance.
Figure 1. DS100BR111 Pin Diagram 24 lead
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