Datasheet
Table Of Contents
- 1 Features
- 2 Applications
- 3 Description
- Table of Contents
- 4 Revision History
- 5 Terminal Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Applications and Implementation
- 9 Power Supply Recommendations
- 10 Layout
- 11 Device and Documentation Support
- 12 Mechanical, Packaging, and Orderable Information
DRV8837, DRV8838
SLVSBA4C –JUNE 2012–REVISED FEBRUARY 2014
www.ti.com
Thermal Shutdown (TSD): If the die temperature exceeds safe limits, all FETs in the H-bridge will be disabled.
After the die temperature falls to a safe level, operation automatically resumes.
Table 3. Fault Behavior
Fault Condition H-bridge Recovery
VCC undervoltage (UVLO) VCC < 1.7 V Disabled VCC > 1.8 V
Overcurrent (OCP) I
OUT
> 1.9 A (MIN) Disabled t
RETRY
elapses
Thermal Shutdown (TSD) T
J
> 150°C (MIN) Disabled T
J
< 150°C
7.4 Device Functional Modes
The DRV883x is active unless the nSLEEP pin is brought logic low. In sleep mode the H-bridge FETs are
disabled Hi-Z. The DRV883x is brought out of sleep mode automatically if nSLEEP is brought logic high.
The H-bridge outputs are disabled during undervoltage lockout, overcurrent, and overtemperature fault
conditions.
Table 4. Operation Modes
Mode Condition H-bridge
Operating nSLEEP pin = 1 Operating
Sleep mode nSLEEP pin = 0 Disabled
Fault encountered Any fault condition met Disabled
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