Datasheet

DRV8833
www.ti.com SLVSAR1C –JANUARY 2011–REVISED JANUARY 2013
Table 1. TERMINAL FUNCTIONS
PIN PIN EXTERNAL COMPONENTS
NAME I/O
(1)
DESCRIPTION
(PWP or PW) (RTY) OR CONNECTIONS
POWER AND GROUND
13
11 Both the GND pin and device PowerPAD
GND PPAD - Device ground
PPAD must be connected to ground
(PWP only)
Connect to motor supply. A 10-µF
VM 12 10 - Device power supply (minimum) ceramic bypass capacitor to
GND is recommended.
Bypass to GND with 2.2-μF, 6.3-V
VINT 14 12 - Internal supply bypass
capacitor
Connect a 0.01-μF, 16-V (minimum) X7R
VCP 11 9 IO High-side gate drive voltage
ceramic capacitor to VM
CONTROL
Logic input controls state of AOUT1.
AIN1 16 14 I Bridge A input 1
Internal pulldown.
Logic input controls state of AOUT2.
AIN2 15 13 I Bridge A input 2
Internal pulldown.
Logic input controls state of BOUT1.
BIN1 9 7 I Bridge B input 1
Internal pulldown.
Logic input controls state of BOUT2.
BIN2 10 8 I Bridge B input 2
Internal pulldown.
Logic high to enable device, logic low to
nSLEEP 1 15 I Sleep mode input enter low-power sleep mode and reset all
internal logic. Internal pulldown.
STATUS
Logic low when in fault condition
nFAULT 8 6 OD Fault output
(overtemp, overcurrent)
OUTPUT
Connect to current sense resistor for
AISEN 3 1 IO Bridge A ground / Isense bridge A, or GND if current control not
needed
Connect to current sense resistor for
BISEN 6 4 IO Bridge B ground / Isense bridge B, or GND if current control not
needed
AOUT1 2 16 O Bridge A output 1
Connect to motor winding A
AOUT2 4 2 O Bridge A output 2
BOUT1 7 5 O Bridge B output 1
Connect to motor winding B
BOUT2 5 3 O Bridge B output 2
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
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