Datasheet

1
2
3
4
10
9
8
7
GND
(PPAD)
IN2
IN1
VREF
VSET
OUT1
VCC
ISENSE
OUT2
5
6
FAULTnGND
DGQ OR DRC PACKAGE
(TOP VIEW)
DRV8832
www.ti.com SLVSAB3H –MAY 2010–REVISED OCTOBER 2013
Table 1. TERMINAL FUNCTIONS
EXTERNAL COMPONENTS
NAME PIN I/O
(1)
DESCRIPTION
OR CONNECTIONS
GND 5 - Device ground
Bypass to GND with a 0.1-μF (minimum)
VCC 4 - Device and motor supply
ceramic capacitor.
IN1 9 I Bridge A input 1 Logic high sets OUT1 high
IN2 10 I Bridge A input 2 Logic high sets OUT2 high
VREF 8 O Reference voltage output Reference voltage output
VSET 7 I Voltage set input Input voltage sets output regulation voltage
Open-drain output driven low if fault condition
FAULTn 6 OD Fault output
present
OUT1 3 O Bridge output 1 Connect to motor winding
OUT2 1 O Bridge output 2 Connect to motor winding
Connect current sense resistor to GND.
ISENSE 2 IO Current sense resistor
Resistor value sets current limit level.
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
ABSOLUTE MAXIMUM RATINGS
(1)(2)
VALUE UNIT
VCC Power supply voltage range –0.3 to 7 V
Input pin voltage range –0.5 to 7 V
Peak motor drive output current
(3)
Internally limited A
Continuous motor drive output current
(3)
1 A
Continuous total power dissipation See Dissipation Ratings table
T
J
Operating virtual junction temperature range –40 to 150 °C
T
stg
Storage temperature range –60 to 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Power dissipation and thermal limits must be observed.
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