Datasheet
DRV8828
www.ti.com
SLVSA11E –OCTOBER 2009–REVISED AUGUST 2013
Table 1. TERMINAL FUNCTIONS
EXTERNAL COMPONENTS
NAME PIN I/O
(1)
DESCRIPTION
OR CONNECTIONS
POWER AND GROUND
GND 14, 28 - Device ground
Connect to motor supply (8 - 45 V). Both pins
VM 4, 11 - Bridge power supply
must be connected to same supply.
Bypass to GND with a 0.47-μF 6.3-V ceramic
V3P3OUT 15 O 3.3-V regulator output
capacitor. Can be used to supply VREF.
CP1 1 IO Charge pump flying capacitor
Connect a 0.01-μF 50-V capacitor between CP1
and CP2.
CP2 2 IO Charge pump flying capacitor
Connect a 0.1-μF 16-V ceramic capacitor and a
VCP 3 IO High-side gate drive voltage
1-MΩ resistor to VM.
CONTROL
ENBL 21 I Bridge enable Logic high to enable H-bridge. Internal pulldown.
Logic high sets OUT1 high, OUT2 low. Internal
PHASE 20 I Bridge phase (direction)
pulldown.
I0 23 I
I1 24 I
Sets winding current as a percentage of full-scale.
I2 25 I Current set inputs
Internal pulldown.
I3 26 I
I4 27 I
Low = slow decay, open = mixed decay,
DECAY 19 I Decay mode high = fast decay
Internal pulldown and pullup.
Active-low reset input initializes internal logic and
nRESET 16 I Reset input
disables the H-bridge outputs. Internal pulldown.
Reference voltage for winding current set. Both
pins must be connected together on the PCB. A
VREF 12, 13 I Current set reference input
0.01-µF bypass capacitor to GND is
recommended.
Logic high to enable device, logic low to enter low-
nSLEEP 17 I Sleep mode input
power sleep mode. Internal pulldown.
NC 22 No connect Leave this pin unconnected.
STATUS
Logic low when in fault condition (overtemp,
nFAULT 18 OD Fault
overcurrent)
OUTPUT
Connect to current sense resistor. Both pins must
ISEN 6, 9 IO Bridge ground / Isense
be connected together on the PCB.
OUT1 5, 10 O Bridge output 1
Connect to motor winding. Both pins must be
connected together on the PCB.
OUT2 7, 8 O Bridge output 2
(1) Directions: I = input, O = output, OZ = tri-state output, OD = open-drain output, IO = input/output
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