Datasheet

20
25
30
35
40
45
50
55
60
65
70
0
10 20 30 40 50 60 70 80 90
Backside Copper Area - cm
2
Thermal Resistance (R ) - °C/W
qJA
Low-K PCB (2 layer)
High-K PCB (4 layer with ground plane)
DRV8823
www.ti.com SLVS913D –JANUARY 2009–REVISED JANUARY 2010
Figure 5. Thermal Resistance vs. Copper Plane Area
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Product Folder Link(s): DRV8823