Datasheet

DRV8662
www.ti.com SLOS709A –JUNE 2011–REVISED NOVEMBER 2012
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
Supply voltage VDD –0.3 to 6.0 V
V
I
Input voltage IN+, IN-, EN, GAIN0, GAIN1, FB –0.3 to V
DD
+ 0.3 V
Boost/Output Voltage PVDD, SW, OUT+, OUT- 120 V
T
A
Operating free-air temperature range –40 to 70 °C
T
J
Operating junction temperature range –40 to 150 °C
T
stg
Storage temperature range –65 to 85 °C
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds (RGP) 260 °C
HBM 2500 V
ESD Protection
CDM 1500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN TYP MAX UNIT
V
DD
Supply voltage VDD 3.0 5.5 V
V
BST
Boost voltage VBST 15 105 V
V
IN
Differential input voltage 1.8
(1)
V
VBST = 105 V, Frequency = 500 Hz, V
O,PP
= 200 V 50
VBST = 105 V, Frequency = 300 Hz, V
O,PP
= 200 V 100
VBST = 80 V, Frequency = 300 Hz, V
O,PP
= 150 V 150 nF
C
L
Load capacitance VBST = 55 V, Frequency = 300 Hz, V
O,PP
= 100 V 330
VBST = 30 V, Frequency = 300 Hz, V
O,PP
= 50 V 680
VBST = 25 V, Frequency = 300 Hz, V
O,PP
= 40 V 1
µF
VBST = 15 V, Frequency = 300 Hz, V
O,PP
= 20 V 3
V
IL
Digital input low EN, GAIN0, GAIN1 V
DD
= 3.6 V 0.75 V
voltage
V
IH
Digital input high EN, GAIN0, GAIN1 V
DD
= 3.6 V 1.4 V
voltage
R
EXT
Current limit control resistor 6 35 kΩ
L Inductance for Boost Converter 3.3 µH
(1) Gains are optimized for a 1.8V peak input
THERMAL INFORMATION
DRV8662
THERMAL METRIC
(1)
UNITS
RGP (20 PINS)
θ
JA
Junction-to-ambient thermal resistance 33.1
θ
JCtop
Junction-to-case (top) thermal resistance 30.9
θ
JB
Junction-to-board thermal resistance 8.7
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 8.7
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.5
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(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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