Datasheet

DRV8601
SLOS629B –JULY 2010– REVISED JANUARY 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Pin Functions
PIN
INPUT/OUTPUT/
DESCRIPTION
POWER (I/O/P)
NAME BALL (ZQV) PIN (DRB)
IN1 C3 4 I Input to driver
IN2 C2 3 I Input to driver
OUT+ B3 5 O Positive output
OUT- A1 8 O Negative output
REFOUT C1 2 O Reference voltage output
EN B1 1 I Chip enable
VDD A3 6 P Supply voltage
GND B2 7 P Ground
ORDERING INFORMATION
MicroStar Junior™ QFN Package
(ZQV) (DRB)
Device DRV8601ZQVR
(1)(2)
DRV8601DRB
(2)
Symbolization HSMI 8601
(1) The ZQV packages are only available taped and reeled. The suffix R
designates taped and reeled parts in quantities of 2500.
(2) For the most current package and ordering information, see the
Package Option Addendum at the end of this document or visit the
TI website at www.ti.com
THERMAL INFORMATION
DRV8601
THERMAL METRIC
(1)
UNITS
ZQV (8 BALLS) DRB (8 PINS)
θ
JA
Junction-to-ambient thermal resistance 78 52.8
θ
JCtop
Junction-to-case (top) thermal resistance 155 63
θ
JB
Junction-to-board thermal resistance 65 28.4
°C/W
ψ
JT
Junction-to-top characterization parameter 5 2.7
ψ
JB
Junction-to-board characterization parameter 50 28.6
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a 11.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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