Datasheet

DRV8412
DRV8432
SLES242C –DECEMBER 2009–REVISED MAY 2010 www.ti.com
B1: Do not block the heat transfer path at bottom side. Clear as much space as possible for better heat spreading.
Figure 16. Printed Circuit Board – Bottom Layer
THERMAL INFORMATION
The thermally enhanced package provided with the DRV8432 is designed to interface directly to heat sink using
a thermal interface compound, (e.g., Ceramique from Arctic Silver, TIMTronics 413, etc.). The heat sink then
absorbs heat from the ICs and couples it to the local air. It is also a good practice to connect the heatsink to
system ground on the PCB board to reduce the ground noise.
R
qJA
is a system thermal resistance from junction to ambient air. As such, it is a system parameter with the
following components:
• R
qJC
(the thermal resistance from junction to case, or in this example the power pad or heat slug)
• Thermal grease thermal resistance
• Heat sink thermal resistance
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