Datasheet

DRV8312
DRV8332
www.ti.com SLES256C –MAY 2010–REVISED OCTOBER 2013
PACKAGE HEAT DISSIPATION RATINGS
PARAMETER DRV8312 DRV8332
R
θJC
, junction-to-case (power pad / heat slug)
1.1 °C/W 0.9 °C/W
thermal resistance
This device is not intended to be used
without a heatsink. Therefore, R
θJA
is not
R
θJA
, junction-to-ambient thermal resistance 25 °C/W
specified. See the Thermal Information
section.
Exposed power pad / heat slug area 34 mm
2
80 mm
2
PACKAGE POWER DERATINGS (DRV8312)
(1)
DERATING
T
A
= 25°C
FACTOR T
A
= 70°C POWER T
A
= 85°C POWER T
A
= 125°C POWER
PACKAGE POWER
ABOVE T
A
= RATING RATING RATING
RATING
25°C
44-PIN TSSOP (DDW) 5.0 W 40.0 mW/°C 3.2 W 2.6 W 1.0 W
(1) Based on EVM board layout
MODE SELECTION PINS
MODE PINS
OUTPUT
DESCRIPTION
CONFIGURATION
M3 M2 M1
1 0 0 1 3PH or 3 HB Three-phase or three half bridges with cycle-by-cycle current limit
Three-phase or three half bridges with OC latching shutdown (no cycle-by-
1 0 1 1 3PH or 3 HB
cycle current limit)
0 x x Reserved
1 1 x Reserved
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