Datasheet
DRV8313
www.ti.com
SLVSBA5A –OCTOBER 2012–REVISED NOVEMBER 2012
DRV8313 TRIPLE HALF-H-BRIDGE DRIVER IC
Check for Samples: DRV8313
1
FEATURES
DESCRIPTION
The DRV8313 provides three individually controllable
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• Three Half-H-Bridge Driver IC
half-H-bridge drivers. It is intended to drive a three-
– Drives 3-Phase Brushless DC Motors
phase brushless dc motor, though it can also be used
– Individual Half-Bridge Control
to drive solenoids or other loads. Each output driver
channel consists of N-channel power MOSFETs
– Pins for Low-Side Current Sensing
configured in a half-H-bridge configuration. The
– Low MOSFET On-Resistance
design brings the ground terminals of each driver to
• 2.5-A Maximum Drive Current at 24 V, 25°C
pins, to allow one to perform current sensing on each
output.
• Uncommitted Comparator Can Be Used for
Current Limit or Other Functions
Current-limit circuitry or other functions are possible
• Built-In 3.3-V 10-mA LDO Regulator
uses of an uncommitted comparator.
• 8-V to 60-V Operating Supply Voltage Range
The DRV8313 can supply up to 2.5-A peak or 1.75-A
rms output current per channel (with proper PCB
• Thermally Enhanced Surface-Mount Package
heatsinking at 24 V and 25°C) per half-H-bridge.
APPLICATIONS
The device provides internal shutdown functions for
overcurrent protection, short-circuit protection,
• HVAC Motors
undervoltage lockout, and overtemperature.
• Consumer Products
The DRV8313 comes in a 28-pin HTSSOP
• Office Automation Machines
PowerPAD™ package.
• Factory Automation
• Robotics
ORDERING INFORMATION
(1)
ORDERABLE PART NUMBER PACKAGE
(2)
TOPSIDE MARKING SHIPPING
DRV8313PWPR Reel of 2000
HTSSOP – PWP DRV8313
DRV8313PWP Tube of 50
(1) For the most-current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) See package drawings, thermal data, and symbolization at www.ti.com/packaging.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.