Datasheet

DRV8301

SLOS719B –AUGUST 2011–REVISED AUGUST 2013

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PIN FUNCTIONS (continued)

I/O

(1)

DESCRIPTION

NAME NO.

BST_C 38 P Bootstrap cap pin for half-bridge C

SL_B 39 I Low-Side MOSFET source connection, half-bridge B. Low-side V

measured between this pin and

SH_B.

GL_B 40 O Gate drive output for Low-Side MOSFET, half-bridge B

SH_B 41 I High-Side MOSFET source connection, half-bridge B. High-side V

measured between this pin and

PVDD1.

GH_B 42 O Gate drive output for High-Side MOSFET, half-bridge B

BST_B 43 P Bootstrap cap pin for half-bridge B

SL_A 44 I Low-Side MOSFET source connection, half-bridge A. Low-side V

measured between this pin and

SH_A.

GL_A 45 O Gate drive output for Low-Side MOSFET, half-bridge A

SH_A 46 I High-Side MOSFET source connection, half-bridge A. High-side V

measured between this pin and

PVDD1.

GH_A 47 O Gate drive output for High-Side MOSFET, half-bridge A

BST_A 48 P Bootstrap cap pin for half-bridge A

VDD_SPI 49 I SPI supply pin to support 3.3V or 5V logic. Connect to either 3.3V or 5V.

PH 50, 51 O The source of the internal high side MOSFET of buck converter

BST_BK 52 P Bootstrap cap pin for buck converter

PVDD2 53,54 P Power supply pin for buck converter, PVDD2 cap should connect to GND.

EN_BUCK 55 I Enable buck converter. Internal pull-up current source. Pull below 1.2V to disable. Float to enable.

Adjust the input undervoltage lockout with two resistors

SS_TR 56 I Buck soft-start and tracking. An external capacitor connected to this pin sets the output rise time. Since

the voltage on this pin overrides the internal reference, it can be used for tracking and sequencing. Cap

should connect to GND

GND 57 P GND pin. The exposed power pad must be electrically connected to ground plane through soldering to

(POWER PCB for proper operation and connected to bottom side of PCB through vias for better thermal

PAD) spreading.

Product Folder Links: DRV8301