Datasheet
DRV8301
SLOS719B –AUGUST 2011–REVISED AUGUST 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
VALUE
UNITS
MIN MAX
PVDD Supply voltage range including transient Relative to PGND –0.3 70 V
PVDD
RAMP
Maximum supply voltage ramp rate Voltage rising up to PVDD
MAX
1 V/µS
V
PGND
Maximum voltage between PGND and GND ±0.3 V
I
IN_MAX
Maximum current for all digital and analog inputs (INH_A, INL_A, INH_B, INL_B, ±1 mA
INH_C, INL_C, SCLK, SCS, SDI, EN_GATE, DC_CAL, DTC)
I
IN_OD_MAX
Maximum sinking current for open drain pins (FAULT and OCTW Pins) 7 mA
V
OPA_IN
Voltage range for SPx and SNx pins ±0.6 V
V
LOGIC
Input voltage range for logic/digital pins (INH_A, INL_A, INH_B, INL_B, INH_C, -0.3 7 V
INL_C, EN_GATE, SCLK, SDI, SCS, DC_CAL)
V
GVDD
Maximum voltage for GVDD Pin 13.2 V
V
AVDD
Maximum voltage for AVDD Pin 8 V
V
DVDD
Maximum voltage for DVDD Pin 3.6 V
V
VDD_SPI
Maximum voltage for VDD_SPI Pin 7 V
V
SDO
Maximum voltage for SDO Pin VDD_SPI +0.3 V
V
REF
Maximum reference voltage for current amplifier 7 V
I
REF
Maximum current for REF Pin 100 µA
T
J
Maximum operating junction temperature range –40 150 °C
T
STORAGE
Storage temperature range –55 150 °C
Capacitive discharge model 500 V
Human body model 2000 V
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DRV8301
THERMAL METRIC
(1)
DCA UNITS
(56) PINS
θ
JA
Junction-to-ambient thermal resistance 30.3
θ
JCtop
Junction-to-case (top) thermal resistance 33.5
θ
JB
Junction-to-board thermal resistance 17.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.9
ψ
JB
Junction-to-board characterization parameter 7.2
θ
JCbot
Junction-to-case (bottom) thermal resistance 0.9
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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