Datasheet

20 19 18 17 16
15
14
13
12
11
10
9 8 7 6
5
4
3
2
1
NC PVDD
SDL
SGND
NC
C1P
PGND
C1N
NC
PVSS
INR
SDR
INL
NC
OUTR
NC
SVSS
NC
OUTL
SVDD
NC − Nointernalconnection
DRV601
SLOS553C –JANUARY 2008–REVISED SEPTEMBER 2009......................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
RTJ (QFN) PACKAGE
(TOP VIEW)
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
NAME QFN
C1P 1 I/O Charge pump flying capacitor positive terminal
PGND 2 I Power ground, connect to ground.
C1N 3 I/O Charge pump flying capacitor negative terminal
NC 4, 6, 8, 12, 16, 20 No connection
PVSS 5 O Output from charge pump.
SVSS 7 I Amplifier negative supply, connect to PVSS via star connection.
OUTL 9 O Left audio channel output signal
SVDD 10 I Amplifier positive supply, connect to PVDD via star connection.
OUTR 11 O Right audio channel output signal
INL 13 I Left audio channel input signal
SDR 14 I Right channel shutdown, active low logic.
INR 15 I Right audio channel input signal
SGND 17 I Signal ground, connect to ground.
SDL 18 I Left channel shutdown, active low logic.
PVDD 19 I Supply voltage, connect to positive supply.
Exposed Pad
Exposed pad must be soldered to a floating plane. Do NOT connect to power or ground.
2 Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): DRV601