Datasheet

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8.2 Parts List
8.3 PCB Specifications
Design Documentation
Table 8. DRV601EVM Parts List
Qty Part Reference Description Manufacture First Mfr P/N
4 C11 C12 C13 C14 Ceramic 1 µ F / 16V / 20% X7R 0805 Capacitor BC Components 0805B105M160NT
2 C15 C16 Metal Film 1uF / 16V / 20% Polyester 1210 Capacitor Panasonic ECPU1C105MA5
2 C17 C18 Ceramic 330 pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N331K500NT
2 C19 C20 Ceramic 33 pF / 50V / 10% NP0 0603 Capacitor BC Components 0603N330K500NT
1 J10 2 pins / 1 row / 2,54mm Pitch Vertical Male Friction Molex 22-27-2021
Lock Pin Header
4 J11 J12 J21 J22 Horizontal Female w. Switch Coax Phono socket Chunfeng RJ843-4W
1 PCB11 A834-PCB-001_2.00 / DRV601EVM Printed Circuit Printline A834-PCB-001(2.00)
Board (ver. 2.00)
2 R11 R12 15k / 100 mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0715KL
3 R13 R14 R15 47k / 100 mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0747KL
2 R16 R17 30k / 100 mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0730KL
2 R18 R19 10R / 100 mW / 5% / 0603 Thick Film Resistor Yageo RC0603JR-0710RL
1 SW1 Switch 6 mm SMD Tactile Switch Omron B3S-1000
1 U1 DRV601 / DirectPath™ Audio Line Driver with external Texas Instruments DRV601RTJT
gain setting. (QFN-20)
Table 9. PCB Specifications
BOARD IDENTIFICATION A834-PCB-001(2.00)
BOARD TYPE Double-sided plated-through board
LAMINATE TYPE FR4
LAMINATE THICKNESS 1,6 mm
COPPER THICKNESS 35 µ m (Include plating exterior layer)
COPPER PLATING OF HOLES > 25 µ m
MINIMUM HOLE DIAMETER 0,3 mm
SILKSCREEN COMPONENT SIDE White—Remove silkscreen from solder area and pre-tinned areas
SILKSCREEN SOLDER SIDE None
SOLDER MASK COMPONENT SIDE Green
SOLDER MASK SOLDER SIDE Green
PROTECTIVE COATING Solder coating and chemical silver on free copper
ELECTRICAL TEST PCB must be electrically tested
MANUFACTURED TO PERFAG 2E (www.perfag.dk )
APERTURE TABLE PERFAG 10A (www.perfag.dk )
BOARD SIZE 60 mm × 50 mm
COMMENTS See drill information file (A834-PCB-001 (DrillDrawing).pdf)
20 DRV601EVM SLOU215 – January 2008
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