Datasheet
DRV593
DRV594
SLOS401C –OCTOBER 2002–REVISED JULY 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION
(1)
PowerPAD QUAD FLATPACK
T
A
(VFP)
DRV593VFP
(2)
–40°C to 85°C
DRV594VFP
(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI Web site at www.ti.com
(2) This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number (e.g., DRV593VFPR or DRV594VFPR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
DRV593, DRV594
AVDD, PVDD Supply voltage –0.3 V to 5.5 V
V
I
Input voltage –0.3 V to V
DD
+ 0.3 V
I
O
(FAULT0, FAULT1) Output current 1 mA
Continuous total power dissipation See Dissipation Rating Table
T
A
Operating free-air temperature range –40°C to 85°C
T
J
Operating junction temperature range –40°C to 150°C
T
stg
Storage temperature range –65°C to 165°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
AVDD, PVDD Supply voltage 2.8 5.5 V
V
IH
High-level input voltage FREQ, INT/EXT, SHUTDOWN, COSC 2 V
V
IL
Low-level input voltage FREQ, INT/EXT, SHUTDOWN, COSC 0.8 V
T
A
Operating free-air temperature –40 85 °C
PACKAGE DISSIPATION RATINGS
q
JA
(1)
q
JC
T
A
=25°C
PACKAGE
(°C/W) (°C/W) POWER RATING
VFP 29.4 1.2 4.1 W
(1) This data was taken using 2 oz trace and copper pad that is soldered directly to a JEDEC standard
4-layer 3 in × 3 in PCB.
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Product Folder Link(s): DRV593 DRV594