Datasheet

DRV2605
www.ti.com SLOS825C –DECEMBER 2012–REVISED SEPTEMBER 2014
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range, T
A
= 25°C (unless otherwise noted)
MIN MAX UNIT
V
DD
–0.3 6 V
EN –0.3 V
DD
+ 0.3 V
Input voltage SDA –0.3 V
DD
+ 0.3 V
SCL –0.3 V
DD
+ 0.3 V
IN/TRIG –0.3 V
DD
+ 0.3 V
Operating free-air temperature range, T
A
–40 85 °C
Operating junction temperature range, T
J
–40 150 °C
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–2000 2000
pins
(1)
V
(ESD)
Electrostatic discharge V
Charged device model (CDM), per JEDEC specification
–500 500
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
Supply voltage V
DD
2.5 5.5 V
ƒ
(PWM)
PWM input frequency IN/TRIG Pin 10 250 kHz
Z
L
Load impedance V
DD
= 5.2 V 8 Ω
V
IL
Digital low-level input voltage EN, IN/TRIG, SDA, SCL 0.5 V
V
IH
Digital high-level input voltage EN, IN/TRIG, SDA, SCL 1.3 V
V
I(ANA)
Input voltage (analog mode) IN/TRIG 0 1.8 V
ƒ
(LRA)
LRA Frequency Range 125 300 Hz
6.4 Thermal Information
DSBGA
THERMAL METRIC
(1)
UNIT
(9-PINS)
R
θJA
Junction-to-ambient thermal resistance 145.2
R
θJC(top)
Junction-to-case (top) thermal resistance 0.9
R
θJB
Junction-to-board thermal resistance 105
°C/W
ψ
JT
Junction-to-top characterization parameter 5.1
ψ
JB
Junction-to-board characterization parameter 103.3
R
θJC(bot)
Junction-to-case (bottom) thermal resistance —
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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