Datasheet

DRV102
12
SBVS009B
www.ti.com
FIGURE 11. TO-220 Thermal Resistance versus Aluminum Plate Area.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction-to-ambient as a function of the copper area.
POWER DISSIPATION
Power dissipation depends on power supply, signal, and load
conditions. Power dissipation is equal to the product of
FIGURE 10. TO-220 and DDPAK Solder Footprints.
PACKAGE MOUNTING
Figure 10 provides recommended PCB layouts for both the
TO-220 and DDPAK power packages. The tab of both
packages is electrically connected to ground (pin 4). It may
be desirable to isolate the tab of TO-220 package from its
mounting surface with a mica (or other film) insulator (see
Figure 11). For lowest overall thermal resistance, it is best to
isolate the entire heat sink/DRV102 structure from the
mounting surface rather than to use an insulator between the
semiconductor and heat sink.
7-Lead DDPAK
(1)
KTW Package
(2)
7-Lead TO-220
KVT Package
(2)
0.335
0.15
0.05
0.45
0.51
0.105
0.05
0.035
0.04
0.2
0.085
Mean dimensions given in inches. Refer to the end of
this data sheet for tolerances and detailed package
drawings. For further information on solder pads for
surface-mount devices, consult Application Bulletin
AB-132 (SBFA015), available for download at
www.ti.com.
For improved thermal performance increase footprint area.
See Figure 11,
Thermal Resistance vs Circuit Board Copper Area .
Refer to the mechanical drawings at the end of this document.
NOTES:(1)
(2)
012345678
18
16
14
12
10
8
Thermal Resistance
JA
(°C/W)
Aluminum Plate Area (inches
2
)
THERMAL RESISTANCE
vs ALUMINUM PLATE AREA
Aluminum Plate Area
Flat, Rectangular
Aluminum Plate
DRV102
TO-220 Package
θ
0.030
0.062
0.050
Vertically Mounted
in Free Air
Optional mica or film insulator
for electrical isolation. Adds
approximately 1°C/W.
Aluminum Plate
Thickness (inches)