Datasheet

DLP4500
DLPS028A –APRIL 2013–REVISED MAY 2013 www.ti.com
Thermal Characteristics
Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the
maximum temperature of any individual micromirror in the active array, the maximum temperature of the window
aperture, and the temperature gradient between any two points on or within the package.
See the Absolute Maximum Ratings and Recommended Operation Conditions for applicable temperature limits.
Package Thermal Resistance
The DMD is designed to conduct the absorbed and dissipated heat back to the Series FQE or FQD package
where it can be removed by an appropriate system thermal management. The system thermal management
must be capable of maintaining the package within the specified operational temperatures at the Thermal Test
Point location, see Figure 16 or Figure 17. The total heat load on the DMD is typically driven by the incident light
absorbed by the active area; although other contributions can include light energy absorbed by the window
aperture, electrical power dissipation of the array, and/or parasitic heating.
Table 7. FQE and FQD Package Thermal Resistance
Min Nom Max Units
Thermal resistance from active area to case 2 °C/W
Case Temperature
The temperature of the DMD case can be measured directly. For consistency, a thermal test point location is
defined, as shown in Figure 16 and Figure 17.
Figure 16. Thermal Test Point Location for FQE
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