Datasheet

DLP4500
DLPS028A –APRIL 2013–REVISED MAY 2013 www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted). Stresses beyond those listed under Absolute Maximum
Ratings may cause permanent damage to the device. The Absolute Maximum Ratings are stress ratings only, and functional
performance of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PARAMETER CONDITIONS MIN MAX UNIT
Electrical
VCC Voltage applied to VCC
(1)
–0.5 4 V
VREF Voltage applied to VREF
(1)
–0.5 4 V
VOFFSET Voltage applied to VOFFSET
(1)(2)
–0.50 8.75 V
VBIAS Voltage applied to VBIAS
(1)(2)
–0.5 17.0 V
VRESET Voltage applied to VRESET
(1)
–11 0.5 V
Supply voltage delta |VBIAS – VOFFSET|
(2)
8.75 V
Voltage applied to all other input terminals –0.5 VREF + 0.5 V
Current required from a high-level output V
OH
= 1.4 V –9 mA
Current required from a low-level output V
OL
= 0.4 V 18 mA
Environmental
Storage temperature range
(3)(4)(5)
-40 85 °C
Storage humidity
(3)(4)(5)
Non-condensing 0 95 % RH
< 420 nm 0.68
Illumination power density
(5)(6)
420 nm to 700 nm See
(7)
mW/cm
2
> 700 nm 10
Electrostatic discharge immunity
(8)
All pins 2000 V
(1) All voltages referenced to VSS (ground). Voltages VCC, VREF, VOFFSET, VBIAS, and VRESET are required for proper DMD
operation.
(2) Exceeding the recommended allowable absolute voltage difference between VBIAS and VOFFSET may result in excessive current
draw.
(3) Simultaneous exposure to high storage temperature and high storage humidity may affect device reliability.
(4) As a best practice, TI recommends storing the DMD in a temperature and humidity controlled environment.
(5) Optimal, long-term performance of the Digital Micromirror Device (DMD) can be affected by various application parameters, including
illumination spectrum, illumination power density, micromirror landed duty-cycle, ambient temperature (storage and operating), case
temperature, ambient humidity (storage and operating), and power on/off duty cycle. TI recommends that application-specific effects be
considered as early as possible in the design cycle. Contact your local TI representative for additional information related to optimizing
the DMD performance.
(6) Total integrated illumination power density above or below the indicated wavelength threshold.
(7) Limited only by the resulting array temperature. S the Thermal Characteristics for information related to calculating the micromirror array
temperature.
(8) Tested in accordance with JESD22-A114-B Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM).
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