Datasheet

DLP5500
www.ti.com DLPS013E –APRIL 2010–REVISED SEPTEMBER 2013
Thermal Characteristics
Achieving optimal DMD performance requires proper management of the maximum DMD case temperature, the
maximum temperature of any individual micromirror in the active array, the maximum temperature of the window
aperture, and the temperature gradient between case temperature and the predicted micromirror array
temperature. (see Figure 13).
Refer to the RECOMMEND OPERATING CONDITIONS for applicable temperature limits.
Package Thermal Resistance
The DMD is designed to conduct absorbed and dissipated heat to the back of the Series 450 package where it
can be removed by an appropriate heat sink. The heat sink and cooling system must be capable of maintaining
the package within the specified operational temperatures, refer to Figure 13. The total heat load on the DMD is
typically driven by the incident light absorbed by the active area; although other contributions include light energy
absorbed by the window aperture and electrical power dissipation of the array.
Package Thermal Resistance
Min Nom Max Units
Active Micromirror Array resistance to TC2 0.6 ºC/W
Case Temperature
The temperature of the DMD case can be measured directly. For consistency, a Thermal Test Point locations
TC1 and TC2 are defined, as shown in Figure 13.
Figure 13. Thermal Test Point Location
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