Datasheet

DLP5500
www.ti.com
DLPS013E APRIL 2010REVISED SEPTEMBER 2013
Micromirror Array Physical Characteristics
Physical characteristics of the micromirror array are provided in . Additional details are provided in the Package
Mechanical Characteristics section at the end of this document.
Table 1. Micromirror Array Physical Characteristics
PARAMETER VALUE UNITS
Number of active micromirror columns
(1)
1024 micromirrors
Number of active micromirror rows
(1)
768 micromirrors
Micromirror pitch
(1)
10.8 microns
768 micromirrors
Micromirror active array height
(1)
8.294 millimeters
1024 micromirrors
Micromirror active array width
(1)
11.059 millimeters
Micromirror array border
(2)
10 mirrors or side
(1) See Figure 3
(2) The mirrors that form the array border are hard-wired to tilt in the –12° (“Off”) direction once power is applied to the DMD (see Figure 3
and Figure 4).
Micromirror Array Optical Characteristics
TI assumes no responsibility for end-equipment optical performance. Achieving the desired end-equipment
optical performance involves making trade-off’s between numerous component and system design parameters.
See the following Application Notes for additional details, considerations, and guidelines:
Single-Panel DLP™ Projection System Optics Application Report (TI literature number DLPA002)
Table 2. Micromirror Array Optical Characteristics
PARAMETER CONDITIONS MIN NOM MAX UNIT
DMD “parked” state
(1)(2)(3)
, see Figure 4 0
Micromirror tilt angle, α degrees
DMD “landed” state
(1)(4)(5)
see Figure 4 12
Micromirror tilt angle variation, β
(1)(4)(6)(7)(8)
See Figure 4 –1 1 degrees
Micromirror Cross Over Time
(9)
16 22 us
Micromirror Switching Time
(10)
140 us
Non-adjacent micromirrors 10
Non Operating micromirrors
(11)
micromirrors
adjacent micromirrors 0
Orientation of the micromirror axis-of-
See Figure 3 44 45 46 degrees
rotation
(12)
(1) Measured relative to the plane formed by the overall micromirror array
(2) “Parking” the micromirror array returns all of the micromirrors to an essentially flat (0˚) state (as measured relative to the plane formed
by the overall micromirror array).
(3) When the micromirror array is “parked”, the tilt angle of each individual micromirror is uncontrolled.
(4) Additional variation exists between the micromirror array and the package datums, as shown in the Package Mechanical
Characteristics section at the end of this document.
(5) When the micromirror array is “landed”, the tilt angle of each individual micromirror is dictated by the binary contents of the CMOS
memory cell associated with each individual micromirror. A binary value of “1” will result in a micromirror “landing” in an nominal angular
position of “+12 degrees”. A binary value of 0 will result in a micromirror “landing” in an nominal angular position of “-12 degrees”.
(6) Represents the “landed” tilt angle variation relative to the Nominal “landed” tilt angle.
(7) Represents the variation that can occur between any two individual micromirrors, located on the same device or located on different
devices.
(8) For some applications, it is critical to account for the micromirror tilt angle variation in the overall System Optical Design. With some
System Optical Designs, the micromirror tilt angle variations within a device may result in perceivable non-uniformities in the light field
reflected from the micromirror array. With some System Optical Designs, the micromirror tilt angle variation between devices may result
in colorimetry variations and/or system contrast variations.
(9) Micromirror Cross Over time is primarily a function of the natural response time of the micromirrors.
(10) Micromirror switching is controlled and coordinated by the DLPC200 (TI Literature number DLPS014) AND DLPA200 ( TI Literature
number DLPS015). Nominal Switching time depends on the system implementation and represents the time for the entire micromirror
array to be refreshed.
(11) Non-operating micromirror is defined as a micromirror that is unable to transition nominally from the -12 degree position to +12 degree
or vice versa.
(12) Measured relative to the package datums “B” and “C”, shown in the Package Mechanical Characteristics section at the end of this
document.
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