Datasheet
DLP5500
DLPS013E –APRIL 2010–REVISED SEPTEMBER 2013
www.ti.com
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted). The functional performance of the device specified in this
data sheet is achieved when operating the device within the limits defined by the Recommended Operating Conditions. No
level of performance is implied when operating the device above or below the Recommended Operating Conditions limits.
PARAMETER CONDITIONS MIN NOM MAX UNIT
Electrical
V
CC
LVCMOS interface supply voltage
(1)(2)
3.0 3.3 3.6 V
V
CCI
LVCMOS logic supply voltage
(1)(2)
3.0 3.3 3.6 V
Mirror electrode and HVCMOS supply voltage
V
CC2
8.25 8.5 8.75 V
(1)(2)
V
MBRST
-27 26.5 V
f
DCLK_*
DCLK_A and DCLK_B clock frequency 150 MHz
f
SCP_CLK
SCP_CLK Frequency 500 KHz
Mechanical
Static load applied to each electrical interface
55 N
area no. 1 and no. 2, See
(3)
Figure 7
Static load applied to the thermal interface
111 N
area, See
(4)
Figure 7
Environmental
Operating Temperature -
Device Operating Temperature Micromirror Array 10 70 °C
Temperature
(5)(6)
Operating Case Temperature
(7)(3)
26 °C
Operating Humidity
(7)
Non-Condensing 60 % RH
Operating Device Temperature Gradient
(8)
10 °C
Operating Landed Duty-Cycle
(7)(3)
25 %
(1) All voltages referenced to V
SS
(ground).
(2) Voltages V
CC
, V
CCI
, and V
CC2
, are required for proper DMD operation.
(3) Load should be uniformly distributed across the entire Electrical Interface area #1 and #2.
(4) Load should be uniformly distributed across Thermal Interface Area. Refer to the for size and location of the datum-A surfaces.
(5) Refer to Thermal Characteristics for Thermal Test Point Locations, Package Thermal Resistance, and Device Temperature Calculation.
(6) In some applications, the total DMD heat load can be dominated by the amount of incident light energy absorbed. Refer to the Thermal
Characteristics for further details.
(7) Optimal, long-term performance of the Digital Micromirror Device (DMD) can be affected by various application parameters, including
illumination spectrum, illumination power density, micromirror landed duty cycle, ambient temperature (both storage and operating), case
temperature, ambient humidity (both storage and operating), and power on or off duty cycle. TI recommends that application-specific
effects be considered as early as possible in design cycle. Contact your local Texas Instruments representative for additional information
related to optimizing the DMD performance.
(8) As measured between any two points on the exterior of the package, or as predicted between any two points inside the micromirror
array cavity. See the Thermal Characteristics for information related to calculating the micromirror temperature.
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