Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsDev KitsPCB design board

Table 32-29. Hibernation Module Battery Characteristics ....................................................... 2123

Table 32-30. Hibernation Module Characteristics ................................................................... 2123

Table 32-31. Hibernation Module Tamper I/O Characteristics ................................................. 2124

Table 32-32. Flash Memory Characteristics ........................................................................... 2124

Table 32-33. EEPROM Characteristics ................................................................................. 2125

Table 32-34. Fast GPIO Module Characteristics .................................................................... 2126

Table 32-35. Slow GPIO Module Characteristics ................................................................... 2127

Table 32-36. Pad Voltage/Current Characteristics for Hibernate WAKE Pin ............................. 2128

Table 32-37. Non-Power I/O Pad Voltage/Current Characteristics .......................................... 2129

Table 32-38. EPI Interface Load Conditions .......................................................................... 2129

Table 32-39. EPI SDRAM Characteristics ............................................................................. 2130

Table 32-40. EPI SDRAM Interface Characteristics ............................................................... 2130

Table 32-41. EPI Host-Bus 8 and Host-Bus 16 Interface Characteristics ................................. 2131

Table 32-42. EPI General-Purpose Interface Characteristics .................................................. 2133

Table 32-43. EPI PSRAM Interface Characteristics ................................................................ 2134

Table 32-44. ADC Electrical Characteristics for ADC at 1 Msps .............................................. 2136

Table 32-45. ADC Electrical Characteristics for ADC at 2 Msps .............................................. 2139

Table 32-46. SSI Characteristics .......................................................................................... 2142

Table 32-47. Bi- and Quad-SSI Characteristics ...................................................................... 2144

Table 32-48. I

C Characteristics ........................................................................................... 2145

Table 32-49. Ethernet PHY DC Characteristics ...................................................................... 2146

Table 32-50. MOSC 25-MHz Crystal Specification ................................................................. 2146

Table 32-51. MOSC Single-Ended 25-MHz Oscillator Specification

....................................... 2147

Table 32-52. EN0RREF_CLK 50-MHz Oscillator Specification ................................................ 2147

Table 32-53. Ethernet Controller Enable and Software Reset Timing ...................................... 2148

Table 32-54. MII Serial Management Timing ......................................................................... 2148

Table 32-55. 100 Mb/s MII Transmit Timing ........................................................................... 2149

Table 32-56. 100 Mb/s MII Receive Timing ............................................................................ 2149

Table 32-57. 100Base-TX Transmit Timing (t

R/F

and Jitter) ..................................................... 2150

Table 32-58. 10 Mb/s MII Transmit Timing ............................................................................. 2151

Table 32-59. 10 Mb/s MII Receive Timing ............................................................................. 2151

Table 32-60. 10Base-T Normal Link Pulse Timing ................................................................. 2151

Table 32-61. Auto-Negotiation Fast Link Pulse (FLP) Timing .................................................. 2152

Table 32-62. 100Base-TX Signal Detect Timing ..................................................................... 2152

Table 32-63. RMII Transmit Timing ....................................................................................... 2153

Table 32-64. RMII Receive Timing ........................................................................................ 2153

Table 32-65. ULPI Interface Timing ....................................................................................... 2154

Table 32-66. LCD Controller Load Capacitance Limits ........................................................... 2155

Table 32-67. LCD Switching Characteristics .......................................................................... 2156

Table 32-68. Timing Requirements for LCDDATA in LIDD Mode ............................................. 2157

Table 32-69. Switching Characteristics Over Recommended Operating Characteristics for LCD

Raster Mode .................................................................................................... 2165

Table 32-70. Analog Comparator Characteristics ................................................................... 2171

Table 32-71. Analog Comparator Voltage Reference Characteristics ...................................... 2172

Table 32-72. Analog Comparator Voltage Reference Characteristics, V

DDA

= 3.3V, EN= 1, and

RNG = 0 .......................................................................................................... 2172

Table 32-73. Analog Comparator Voltage Reference Characteristics, V

DDA

= 3.3V, EN= 1, and

RNG = 1 .......................................................................................................... 2172

December 13, 201326

Texas Instruments-Advance Information

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