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Tiva™ TM4C123G Development Board

User's Guide

Literature Number: SPMU357B

August 2013–Revised March 2014

Summary of content (35 pages)

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Tiva™ TM4C123G Development Board User's Guide Literature Number: SPMU357B August 2013 – Revised March 2014
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Contents 1 DK-TM4C123G Overview 1.1 1.2 1.3 1.4 2 Hardware Description 2.1 2.2 2.3 2.4 2.5 3 ...................................................................................................... 4 Kit Contents .................................................................................................................. Using the DK-TM4C123G .................................................................................................. Features ..............................................
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www.ti.com List of Figures 1-1. Board Picture ................................................................................................................ 4 2-1. DK-TM4C123G Development Board Block Diagram ................................................................... 7 2-2. Can Diagram ............................................................................................................... 2-3. Debug Out ..............................................................................
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Chapter 1 SPMU357B – August 2013 – Revised March 2014 DK-TM4C123G Overview The Tiva TM4C123G development kit is an evaluation platform for the Tiva TM4C123GH6PGE ARM® Cortex™-M4-based series microcontrollers. The development board highlights the TM4C123GH6PGE microcontroller's USB 2.0 On-The-Go/Host/Device (OTG/Host/Device) interface, 12-bit Analog-to-Digital Converter (ADC), Real-Time Clock (RTC), and battery-backed Hibernation module. Figure 1-1 shows a photo of the DK-TM4C123G.
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Kit Contents www.ti.com 1.
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Specifications • • • • • • • • • • • • • 1.4 www.ti.com Microcontroller current shunt amplifier 96 x 64 color OLED display USB Micro-AB connector for Host/Device/OTG microSD card slot 5 navigation switches User LED Precision 3.0V reference Connectors for Wireless Evaluation Modules Available I/O brought out to headers on 0.
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Chapter 2 SPMU357B – August 2013 – Revised March 2014 Hardware Description The DK-TM4C123G development board includes a Tiva TM4C123GH6PGE microcontroller and an integrated In-Circuit Debug Interface (ICDI) as well as a range of useful peripheral features (see the block diagram in Figure 2-1). This chapter describes how these peripherals operate and interface to the microcontroller. Wireless Evaluation Module Connector Power Select Jumper Analog CANL CANH Screw Terminals Host 3.0V Ref. Battery 3.
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Microcontroller, USB OTG, User/Navigation Switches, User LED, and GPIO Headers (Schematic page 1) 2.1 www.ti.com Microcontroller, USB OTG, User/Navigation Switches, User LED, and GPIO Headers (Schematic page 1) 2.1.1 Microcontroller The Tiva TM4C123GH6PGE is an ARM® Cortex™-M4-based microcontroller with 256-KB flash memory, 32-KB SRAM, 80-MHz operation, USB Host/Device/OTG, Hibernation module, and a wide range of other peripherals.
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www.ti.com Data Logger, Motion Sensor, Temperature Sensors, CAN Transceiver, OLED, and SD Card (Schematic page 2) 2.1.3 User Switches and User LED Five switches on the board provide navigation and selection for the preloaded quickstart application. These switches can be used for other purposes in the user’s custom applications. The development board also has a green user LED. Table 2-2 shows how these features are connected to the pins on the microcontroller. Table 2-2.
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Data Logger, Motion Sensor, Temperature Sensors, CAN Transceiver, OLED, and SD Card (Schematic page 2) www.ti.com Each of the 4 channels can measure 0-20 V with an approximate 0.01 V resolution. A voltage divider on each channel scales the 0-20 V range on the terminal to the 0-3 V range of the 12-bit Analog-to-Digital Converter (ADC) of the TM4C123GH6PGE microcontroller. Each scaled-down signal passes through a unity-gain amplifier to provide a low-impedance source for the microcontroller’s ADC.
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Data Logger, Motion Sensor, Temperature Sensors, CAN Transceiver, OLED, and SD Card (Schematic page 2) www.ti.com 2.2.4 Temperature Sensors Temperature can be measured by the Texas Instruments TMP20 Analog Temperature Sensor (U3) and/or the internal microcontroller temperature sensor. 2.2.4.1 External TMP20 Temperature Sensor The output of the sensor is connected directly to the microcontroller’s ADC. Table 2-5 shows the signal used by the temperature sensor. Table 2-5.
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Data Logger, Motion Sensor, Temperature Sensors, CAN Transceiver, OLED, and SD Card (Schematic page 2) www.ti.com 2.2.5 MCU Running Current The microcontroller running current IDD can be measured by the microcontroller itself. The output of a Texas Instruments INA198 Current Shunt Amplifier (U15) is connected to the ADC on the microcontroller. This amplifier increases the voltage drop on a 0.1-Ohm current shunt resistor in line with the VDD source for the microcontroller.
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Hibernate, Current Shunts, Power Supplies, Reset and Crystals (Schematic page 3) www.ti.com 2.2.7 OLED Display The development board includes a 96 x 64 color Organic LED (OLED) display. The OLED display is powered from the on-board 13 V regulator, which must be enabled before using the display. Data is written to the display using the SSI2 peripheral. Table 2-9 shows the signals used by the display. Table 2-9.
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Hibernate, Current Shunts, Power Supplies, Reset and Crystals (Schematic page 3) www.ti.com The DK-TM4C123G has additional circuitry that allows the development board to be turned on when a battery is not present or when the battery voltage is too low. A Texas Instruments TPS3803-01 Voltage Detector (U12) monitors VBAT and produces a VBAT_GOOD signal when the battery voltage is above 2.1 V.
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Hibernate, Current Shunts, Power Supplies, Reset and Crystals (Schematic page 3) www.ti.com 2.3.3 Clocking The DK-TM4C123G uses a 16.0-MHz crystal (Y2) to complete the TM4C123GH6PGE microcontroller's main internal clock circuit. An internal PLL, configured in software, multiplies this clock to higher frequencies for core and peripheral timing. The Hibernation module is clocked off of an external 32.768 kHz crystal (Y1). 2.3.
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Debug and Virtual COM Port (Schematic Page 4) 2.4 www.ti.com Debug and Virtual COM Port (Schematic Page 4) 2.4.1 In-Circuit Debug Interface (ICDI) The DK-TM4C123G development board comes with an on-board In-Circuit Debug Interface (ICDI). The ICDI allows for programming and debugging of the TM4C123GH6PGE using LM Flash Programmer and/or any of the supported tool chains. Both JTAG and Serial Wire Debug (SWD) are supported.
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Wireless Evaluation Module Connectors (Schematic Page 5) www.ti.com 2.4.2 Virtual COM Port When plugged into a PC, the device enumerates as a debugger and a virtual COM port. The COM port is connected to the following pins on the MCU. Table 2-14. Virtual COM Port Signals 2.5 GPIO Pin Pin Function PA0 U0RX Virtual COM Port TXD PA1 U0TX RXD Wireless Evaluation Module Connectors (Schematic Page 5) The DK-TM4C123G features a set of Wireless Evaluation Module connectors.
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Chapter 3 SPMU357B – August 2013 – Revised March 2014 Software Development This chapter provides general information on software development as well as instructions for flash memory programming. 3.1 Software Description The software provided with the DK-TM4C123G provides access to all of the peripheral devices supplied in the design. The TivaWare™ for C Series Peripheral Driver Library is used to operate the on-chip peripherals.
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Programming the DK-TM4C123G Board www.ti.com 3.4 Programming the DK-TM4C123G Board The DK-TM4C123G software package includes pre-built binaries for each of the example applications. If you installed the TivaWare™ software to the default installation path of C:\ti\TivaWare_C_Series-x.x, you can find the example applications in C:\ti\TivaWare_C_Series-x.x\examples\boards\dk-tm4c123g. The onboard ICDI is used with the LM Flash Programmer tool to program applications on the DK-TM4C123G board.
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Appendix A SPMU357B – August 2013 – Revised March 2014 Component Locations Figure A-1. DK-TM4C123G Component Locations (Top View) Figure A-2.
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Appendix B SPMU357B – August 2013 – Revised March 2014 Bill of Materials (BOM) Item Ref Qty Description Mfg Part Number 1 BT1 1 Battery Holder, CR2032, SMT Keystone 3002TR Taiyo Yuden TMK212BJ105KG-T 2 C16 1 Capacitor, 1.0uF 25V 10% X5R 0805 3 C20, C78 2 Capacitor, 820pF, 50V, 5%, 0603, COG TDK C1608C0G1H821J 4 C23, C57, C59, C18, C37, C38, C39, C41, C66, C77 10 Capacitor, 0.
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Appendix B www.ti.com Item Ref Qty Description Mfg Part Number 24 J9, J10 2 Header, 2x10, 0.050, SMT, Vertical, Shrouded, Socket Samtec TFM-110-02-S-D-K-A 25 JP1, JP3 2 Header, 1x2, 0.100, T-Hole, Vertical Unshrouded, 0.220 Mate 3M 961102-6404-AR 26 L1 1 Inductor, 3.3uH, SMD, 6mm x 6mm, 1.7A, 0.
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Appendix B www.ti.com Item Ref Qty Description Mfg Part Number 53 U3 1 IC, Analog Temperature Sensor 55C to +130C, +/-2.5C, 5SC70(DCK) Texas Instruments TMP20AIDCKR 54 U4 1 Op Amp, 3 MHz, Quad, Rail-toRail, 14TSSOP Texas Instruments TLV2374IPWR 55 U5 1 Precision 3.
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Appendix C SPMU357B – August 2013 – Revised March 2014 References In addition to this document, the following references are included on the Tiva TM4C123GH6PGE Development Kit USB flash drive and are also available for download at www.ti.com.
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Appendix D SPMU357B – August 2013 – Revised March 2014 Schematics This section contains the schematics for the DK-TM4C123G board.
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External Debug TARGET_DEBUG/COMM J1 1 3 5 7 9 2 T_TMS/SWDIO 4T_TCK/SWDCLK 6 T_TDO/SWO T_TDI 8 T_RESET 10 U1-A T_URX T_UTX PA2/SSI0CLK_SDCLK PA3/SSI0FSS_SDCS PA4/SSI0RX_SDDO PA5/SSI0TX_SDDI PA6 PA7 37 38 39 40 41 42 45 46 EXTDBG 118 117 116 115 36 35 34 33 T_TCK/SWDCLK T_TMS/SWDIO T_TDI T_TDO/SWO EM_SIGNALS +3.3V PC4/U1RX_EM_TX PC5/U1TX_EM_RX PC6_EM_GPIO0 PC7_EM_GPIO1 PE0/AIN3 PE1/AIN2 PE2/AIN1 PE3/AIN0 PE4/CAN0RX PE5/CAN0TX C2 0.
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R16 0 OHM U4-C 9 OMIT R9 105K 0.1% 10 +VBUS +VBUS 8 7 6 5 4 3 2 1 C72 0.1UF OMIT R4 105K 0.1% 12 OMIT 105K 0.1% 3 R46 0 OHM OMIT 105K 0.1% 1 NC1 CS DI VDD CLK VSS DO RSV PE2/AIN1 TLV2374PW 5 + C69 120PF 0.1% 18.0K R17 R7 10K microSD CARD INTERFACE U4-B 6 R14 PA4/SSI0RX_SDDO +3.3V C5 0.1UF - C6 120PF 0.1% 18.
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Power Select +3.3V +VBUS +USB_VBUS +ICDI_VBUS T_RESET J6 R28 10K RESET H119 SW6 U1-B CON-HDR-2X2-100 90 RST VBAT C30 HIB 0.1UF OMIT +VBUS JP1 WAKE +MCU_VBAT 77 73 H116 1K C51 R31 220K PWR_EN 0.1UF WAKE OMIT DIO-1N4448HWS 72 R32 D6 JP3 H132 EN2 +3.3V R21 10K C21 C24 1UF 1UF 5 OC2 6 OUT2 Y1 32.
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+ICDI_3.3V R36 10k 52 51 50 49 16 15 14 13 R37 10k +ICDI_3.
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Wireless EM Connector J9 J10 EM_SIGNALS EM_SIGNALS +3.3V C66 0.01UF Y4 4 3 VCC OUT 1 2 NC GND OSC-ASVK-32.768KHZ-LJT PF0/U1RTS_EM_CTS PC5/U1TX_EM_RX PC4/U1RX_EM_TX PF7/I2C2SDA_EM_I2CSDA PF6/I2C2SCL_EM_I2CSCL PC6_EM_GPIO0 PC7_EM_GPIO1 PH1/SS13FSS_EM_CS PH0/SSI3CLK_EM_SCLK PH3/SSI3TX_EM_MOSI PH2/SSI3RX_EM_MISO 1 3 5 7 9 11 13 15 17 19 2 4 6 8 10 12 14 16 18 20 VSS VDD2(1.8V)OPTION RF_UART_CTS VDD2(1.8V)OPTION RF_SLOW_CLK(32K) VDD2(1.8V)OPTION RF_UART_RX VDD1(3.3V) RF_UART_TX VDD1(3.
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Appendix E SPMU357B – August 2013 – Revised March 2014 Revision History This history highlights the changes made to the SPMU357A device-specific user's guide to make it an SPMU357B revision. Table E-1. Revision History SEE 26 ADDITIONS/MODIFICATIONS/DELETIONS Global Corrected page number links in Table of Contents. Section 1.1 Kit Contents Removed "microSD card".
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ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR EVALUATION MODULES Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following: 1. User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or development environments.
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RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold, or loaned to users may or may not be subject to radio frequency regulations in specific countries. General Statement for EVMs Not Including a Radio For EVMs not including a radio and not subject to the U.S.
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Canada Industry Canada Compliance (French) Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de l'utilisateur pour actionner l'équipement. Concernant les EVMs avec appareils radio Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.