Datasheet
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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
DIR9001
SLES198 – DECEMBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
V
CC
Supply voltage –0.3 to 4 V
V
DD
V
CC
to V
DD
Supply voltage differences ± 0.1 V
AGND to DGND Ground voltage differences ± 0.1 V
Digital input –0.3 to 6.5
Digital input voltage V
Digital output –0.3 to (V
DD
+ 0.3) < 4
XTI, XTO –0.3 to (V
CC
+ 0.3) < 4
Analog input voltage V
FILT –0.3 to (V
CC
+ 0.3) < 4
Input current (any pins except supplies) ± 10 mA
Ambient temperature under bias –40 to 125 ° C
Storage temperature –55 to 150 ° C
Junction temperature 150 ° C
Lead temperature (soldering) 260 ° C, 5 s
Package temperature (reflow, peak) 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
CC
Analog supply voltage 2.7 3.3 3.6 VDC
V
DD
Digital supply voltage 2.7 3.3 3.6 VDC
XTI is connected to clock source 24.576 MHz
Digital input clock frequency
XTI is connected to DGND Not required MHz
Digital output load capacitance, except SCKO 20 pF
Digital output load capacitance (SCKO) 10 pF
T
A
Operating free-air temperature –40 85 ° C
2
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