Datasheet

2 Circuit
+V
S
OUTR
OUTG
OUTB
-VS
-VS
SEL
EN
V
CC
V
EE
V
CC
C
1
2.2 Fm
C
3
0.1 Fm
C
5
0.01 Fm
C
2
2.2 Fm
C
4
0.1 Fm
R
6
75W
R
5
75W
R
11
50W
R
10
50W
R
4
75W
B1
L
1
TB1
L
2
R0
G0
B0
GND
GND
R1
G1
B1
U1
G1
R1
R
3
75W
R
2
75W
R
1
75W
R0
G0
B0
R
9
75W
R
8
75W
R
7
75W
SEL
OUTB
OUTG
OUTR
EN
V
EE
3 Components
Circuit www.ti.com
The circuit schematic in Figure 2 shows the connections for all possible components. Each configuration
uses only some of the components.
Figure 2. Schematic for DEM-OPA-SSOP-3E
Components that have RF performance similar to the ones listed in Table 1 may be substituted. C
1
and C
2
need a larger voltage rating for ± 15V dual supplies.
Table 1. Component Descriptions
PART DESCRIPTION
C
1
, C
2
Tantalum Chip Capacitor, SMD EIA Size 3528, 20V
C
3
, C
4
, C
5
Multilayer Ceramic Chip Capacitor, SMD 1206, 50V
Bx, Gx, Rx, SMA or SMB Board Jack (Amphenol 901-144-8) or
OUTB, OUTG, Side Mount BNC Connection (Trompeter
OUTR, EN, Electronics UCBJE20-1)
SEL
EMI-Suppression Ferrite Chip, SMD 1206
L
1
, L
2
(Steward LI 1206 B 900 R)
Terminal Block, 3.5mm Centers
TB
1
(On-Shore Technology ED555/3DS)
R
7
, R
8
, R
9
, R
10
, Metal Film Chip Resistor, SMD 0603 1/8W
R
11
R
1-6
Thin Film Chip Resistor, SMD 0402 1/16W
DEM-OPA-SSOP-3E Demonstration Fixture2 SBOU043B – February 2007 – Revised April 2009
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