Datasheet

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3 Components
(b)MidLayer1,TopView
(d)BottomLayer,BottomView(c)MidLayer2,TopView
(a)TopLayer,TopView
REVB
Mar04
OUTPUTINPUT
DIS
R1
R3
PR1074
DEM-OPA84xDBV
CPN
C2
R5
R2
R4
U1
C1
C5
TB1
-V
S
C6
+V
S
Components
Components that have RF performance similar to those listed in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
5
, C
6
Tantalum Chip Capacitor, SMD EIA Size 3216, 20V
C
1
, C
2
, C
PN
Multilayer Ceramic Chip Capacitor, SMD 0603, 50V
INPUT, OUTPUT, DIS SMA or SMB Board Jack (Amphenol 901-144-8)
TB1 Terminal Block, 3.5mm Centers (On-Shore Technology ED555/3DS)
R
1
, R
2
, R
3
, R
4
, R
5
Metal Film Chip Resistor, SMD 0603, 1/8W
Please refer to Figure 3 for the location of the following components. R2 and R4 set the I/O impedance;
R1 and R3 set the gain; and C1, C2, C5, C6 and C
PN
are supply bypass capacitors. C
PN
is optional; it
adds a bypass between the supplies, which improves distortion performance for some models. R5 is the
matching resistor for the disable pin.
(1) The board name shown in the top silkscreen is DEM-OPA84xDBV with the Revision B design finalized in
March 2004.
Figure 3. DEM-OPA-SOT-1B Demonstration Fixture Layout
2 DEM-OPA-SOT-1B User's Guide SBOU027B – October 2004 – Revised April 2006
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