Datasheet

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3 Components
(a)TopLayer,TopView (b)MidLayer1,TopView
(d)BottomLayer,BottomView(c)MidLayer2,TopView
Components
Components that have RF performance similar to the ones in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
4
, C
5
Tantalum Chip Capacitor, SMD EIA Size 0805, 20V
C
3
Multilayer Ceramic Chip Capacitor, SMD 0805, 50V
C
1
, C
2
Multilayer Ceramic Chip Capacitor, SMD 0603, 50V
L
1
, L
2
EMI-Suppression Ferrite Chip, SMD 0805
U1 Dual Operational Amplifier
R
1A,B
, R
3A,B
, R
5A,B
Metal Film Chip Resistor, SMD 0603, 1/10W
R
2A,B
, R
4A,B
Metal Film Chip Resistor, SMD 0402, 1/16W
TB1 Terminal Block, 3.5mm Centers (On-Shore Technology ED555/2DS)
In A, In B, Out A, Out B SMA or SMB Board Jack (Amphenol 901-144-8)
Refer to Figure 3 for the location of the following components. R
1A,B
and R
5A,B
set the I/O impedance.
R
3A,B
and R
4A,B
set the gain. R
2A,B
can be used for bias current cancellation as needed. C
1
, C
2
, C
3
, C
4
,
and C
5
are supply bypass capacitors. C
3
is optional; it adds a bypass between the supplies, which may
improve distortion performance for some models.
(1) The board name shown in the silkscreen is DEM-INV-OPA269xD with the Burr-Brown Revision 1 design
finalized in August 2004.
Figure 3. DEM-OPA-SO-2C Demonstration Fixture Layout
2 DEM-OPA-SO-2C Demonstration Fixture SBOU029A – December 2004 – Revised May 2006
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