Datasheet

2 Circuit
SEL
-V
S
+V
S
EN
402W402W
R
2
R
1
J1
J2
J4
J6
J5
R
3
R
4
J3
R
5
C
4
C
3
C
2
C
1
3 Components
Circuit www.ti.com
The circuit schematic illustrated in Figure 2 shows the connections for all possible components.
Figure 2. Schematic
Components that have RF performance similar to those listed in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
3
, C
4
Tantalum Chip Capacitor, SMD EIA Size 3216, 20V
C
1
, C
2
Multi-Layer Ceramic Chip Capacitor, SMD 0603, 50V
J1, J2, J4 SMA or SMB Board Jack (Amphenol 901-144-8) or Side Mount BNC Connection
(Trompeter Electronics UCBJE20-1)
J3, J5 SMA or SMB Board Jack (Amphenol 901-144-8)
J6 Terminal Block, 3.5mm Centers (On-Shore Technology ED555/3DS)
R
X
Metal Film Chip Resistor, SMD 0603, 1/8W
Refer to Figure 3 a for the location of the following components:
• R
1
, R
2
and R
3
set the I/O impedance for the signal chain.
• R
4
and R
5
set the input impedance for the select and enable pins.
• C
1
, C
2
, C
3
, and C
4
are supply bypass capacitors.
DEM-OPA-SO-1D Demonstration Fixture2 SBOU049A – April 2007 – Revised April 2009
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