Datasheet

www.ti.com
2 Circuit
R
4
R
2
R
3
R
7
R
11
R
12
R
13
Out
J
2
3
4
7
6
5
8
2
R
1
R
6
IN
J
1
R
5
C
4
C
6
C
5
C
7
1
GND
+V
S
-V
S
P1
C
3
C
2
+
L
2
L
1
C
1
+
R
8
R
9
V
L
J
H
R
10
V / /SHDN
H
DIS
J
3
3 Components
Circuit
The circuit schematic in Figure 2 shows the connections for all possible components. Each configuration
uses only some of the components.
Figure 2. Schematic for DEM-OPA-SO-1A
Components that have RF performance similar to the ones listed in Table 1 may be substituted. C
1
and C
2
need a larger voltage rating for ± 15V dual supplies.
Table 1. Component Descriptions
PART DESCRIPTION
C
1
, C
2
Tantalum Chip Capacitor, SMD EIA Size 3528, 20V
C
3
– C
7
Multilayer Ceramic Chip Capacitor, SMD 1206, 50V
J
1
– J
4
SMA or SMB Board Jack (Amphenol 901-144-8)
EMI-Suppression Ferrite Chip, SMD 1206
L
1
, L
2
(Steward LI 1206 B 900 R)
Terminal Block, 3.5mm Centers
P
1
(On-Shore Technology ED555/3DS)
R
1
– R
13
Metal Film Chip Resistor, SMD 1206, 1/8 Ω
DEM-OPA-SO-1A Demonstration Fixture2 SBOU009A – June 1998 – Revised March 2006
Submit Documentation Feedback