Datasheet

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3 Components
Components
Components that have RF performance similar to the ones listed in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
1
, C
2
Tantalum Chip Capacitor, SMA EIA Size 3216, 20V
C
5
, C
3
, C
4
Multilayer Ceramic Chip Capacitor, SMD 0603, 25V
+INA, +INB, –INA, –INB, SMA or SMB Board Jack (Amphenol 901-144-8)
OUTA, OUTB, DISA, DISB
L
1
, L
2
EMI-suppression ferrite chip, SMD 0805 (Steward LI 0805 B 900 R)
P
1
Terminal block, 3.5mm centers (On-Shore Technology ED555/3DS)
R
1
R
6
, R
9
, R
12
R
1 4
Metal film chip resistor, SMD 0603, 1/8W
R
7
, R
8
, R
10
, R
11
Metal film chip resistor, SMD 0402, 1/16W
The location of the following components is illustrated in Figure 3 . R
1
and R
2
are the input resistance
matching the source impedance for each amplifier. R
2
and R
5
are series isolation resistance that may help
isolate the input parasitic from the source. R
3
and R
4
are input resistance matching for the disable line. R
7
and R
9
are the gain resistors. Note that in order to have a noninverting configuration, R
13
and R
14
need to
be 0 . If an inverting configuration is desired, R
13
and R
14
are the matching input resistance with R
1
and
R
2
set at 0 . R
8
and R
11
are the feedback resistors. R
9
and R
10
are output matching resistance and
should be set to 50 for a 50 environement. L
1
and L
2
are ferrite chips that can reduce interactions with
the power supply at high frequencies; if not desired, they can be replaced with 0 resistors. The power
supplies are each respectively bypassed with two capacitors: C
1
and C
3
for the positive supply, and C
2
and C
4
for the negative supply. C
4
and C
5
are usually set between 2.2 µ F and 6.8 µ F, where C
2
and C
3
are
0.1 µ F ceramic capacitors. C
5
, usually set at 10nF, is connected between the positive and negative power
supplies.
SBOU040 September 2006 DEM-OPA-MSOP-2B Demonstration Fixture 3
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