Datasheet

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2 Circuit
P
2
R
8
OUTA
R
7
3
1
2
C
2
C
4
R
5
R
6
+
R
4
R
2
R
3
R
1
+INA
4
+V
S
GND
P
1
R
16
OUTB
R
15
5
7
6
C
1
C
3
R
13
R
14
+
R
12
R
10
R
11
R
9
+INB
4
8
J
1
J
2
J
3
J
6
J
4
J
5
-INA
-V
S
GND
-INB
1/2
OPA26xxE
1/2
OPA26xxE
3 Components
Circuit
The circuit schematic in Figure 2 shows the connections for all possible components. Each configuration
uses only some of the components.
Figure 2. Schematic for DEM-OPA-MSOP-2A
Components that have RF performance similar to the ones listed in Table 1 may be substituted.
Table 1. Component Descriptions
PART DESCRIPTION
C
1
, C
2
Multilayer Ceramic Chip Capacitor, Size 1206, 20V
C
3
, C
4
Tantalum Chip Capacitor, Size 3528, 16V
R
1
– R
16
Metal Film Chip Resistor, Size 1206, 1/8W
J
1
– J
6
SMA or SMB Board Jack (Amphenol 901-144-8)
P
1
, P
2
Power Connectors (On-Shore Technology
ED555/2DS)
Resistors R
1
, R
4
, R
9
and R
12
are used to set the input impedance. Resistors R
8
and R
16
set the output
impedance. The values in Table 2 support test equipment with 50 Ω input and output impedances; other
source and load impedances are easily accommodated.
Table 2 lists suggested component values for the a dual voltage feedback operational amplifier in three
different configurations: as a Noninverting Amplifier (NIA), an Inverting Amplifier (IA) and a Difference
Amplifier (DA). The gain for the DA is the differential mode gain. Other dual op amps can also be easily
configured; consult the respective data sheet for a specific op amp to select component values.
DEM-OPA-MSOP-2A Demonstration Fixture2 SBOU004A – June 1997 – Revised May 2006
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