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1 Description

I ,Collector,C

OUT

S/HIn-

S/HIn+

Ground

Emitter,E

Base,B

HOLD

-V

HoldControl

BJT

MSOP-10

User's Guide

SBOU042A – November 2006 – Revised December 2008

DEM-OPA-MSOP-1A Demonstration Fixture

The DEM-OPA-MSOP-1A demonstration fixture is a generic, unpopulated printed circuit board (PCB) for a

single, wide bandwidth, DC restoration circuit in an MSOP-10 package. Figure 1 shows the package

pinout for this PCB. For more information on these types of op amps, as well as good PCB layout

techniques, see the individual amplifier data sheets.

Figure 1. MSOP Package Pinout, Top View

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SBOU042A – November 2006 – Revised December 2008 DEM-OPA-MSOP-1A Demonstration Fixture 1

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Summary of content (6 pages)

PAGE 1
User's Guide SBOU042A – November 2006 – Revised December 2008 DEM-OPA-MSOP-1A Demonstration Fixture 1 Description The DEM-OPA-MSOP-1A demonstration fixture is a generic, unpopulated printed circuit board (PCB) for a single, wide bandwidth, DC restoration circuit in an MSOP-10 package. Figure 1 shows the package pinout for this PCB. For more information on these types of op amps, as well as good PCB layout techniques, see the individual amplifier data sheets.
PAGE 2
Circuit 2 www.ti.com Circuit The circuit schematic in Figure 2 shows the connections for all possible components. Each configuration uses only some of the components. VOUT R1 U1 R2 1 2 R3 3 C1 VSN R4 Base, B IOUT, Collector, C CHOLD S/H In- -VCC S/H In+ 4 5 Hold/Track +VCC Emitter, E Ground Hold Control 10 R10 VSP IOUT R5 9 R6 8 7 VIN R7 6 R8 Component_1 VSP L1 R9 C2 C3 C5 C4 C6 TB1 + + L2 VSN Figure 2.
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Components www.ti.com • L1 and L2 are ferrite chips that can reduce interactions with the power supply at high frequencies. If not desired, they can be replaced with 0Ω resistors. (a) Top Layer (b) Middle Layer 1 (c) bottom Layer (d) Middle Layer 2 Figure 3.
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Board Layout 4 www.ti.com Board Layout This demonstration fixture is a four-layer PCB. It uses a ground plane bottom layer. The ground plane has been opened up around op amp pins that are sensitive to capacitive loading. Power-supply traces are laid out in the internal planes. The SMA (or SMB) connectors may be mounted horizontally onto the board edge. The location and type of capacitors used for power-supply bypassing are crucial for high-frequency amplifiers.
PAGE 5
EVALUATION BOARD/KIT IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have electronics training and observe good engineering practice standards.
PAGE 6
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.