Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
DAC9881
SBAS438A – MAY 2008 – REVISED AUGUST 2008 .........................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY NONLINEARITY PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) LEAD DESIGNATOR RANGE MARKING
DAC9881S ± 3 – 1/+2 QFN-24 RGE – 40 ° C to +105 ° C DAC9881
DAC9881SB ± 2 ± 1 QFN-24 RGE – 40 ° C to +105 ° C DAC9881B
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
website at www.ti.com .
Over operating free-air temperature range (unless otherwise noted).
PARAMETER DAC9881 UNIT
AV
DD
to AGND – 0.3 to 6 V
IOV
DD
to DGND – 0.3 to 6 V
Digital input voltage to DGND – 0.3 to IOV
DD
+ 0.3 V
V
OUT
to AGND – 0.3 to AV
DD
+ 0.3 V
Operating temperature range – 40 to +105 ° C
Storage temperature range – 65 to +150 ° C
Maximum junction temperature (T
J
max) +150 ° C
Thermal impedance ( θ
JA
) 46 ° C/W
Human body model (HBM) 3000 V
ESD ratings
Charged device model (CDM) 1000 V
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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