Datasheet
ABSOLUTE MAXIMUM RATINGS
(1)
DAC8871
SBAS396A – JUNE 2007 – REVISED JUNE 2008 .............................................................................................................................................................
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
MINIMUM
RELATIVE DIFFERENTIAL SPECIFIED
ACCURACY NONLINEARITY TEMPERATURE PACKAGE PACKAGE- PACKAGE
PRODUCT (LSB) (LSB) RANGE MARKING LEAD DESIGNATOR
DAC8871B ± 1 ± 1 – 40 ° C to +105 ° C 8871 TSSOP-16 PW
DAC8871 ± 3 ± 1 – 40 ° C to +105 ° C 8871 TSSOP-16 PW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
website at www.ti.com.
Over operating free-air temperature range (unless otherwise noted).
DAC8871 UNIT
V
DD
to GND – 0.3 to +7 V
Digital input voltage to GND – 0.3 to (V
DD
+ 0.3) V
AGND to DGND – 0.3 to +0.3 V
V
CC
to V
SS
– 0.3 to +39.6 V
V
CC
to AGND – 0.3 to +19.8 V
V
SS
to AGND +0.3 to – 19.8 V
V
REFH
to V
REFL
– 0.3 to +39.6 V
V
REFH
to AGND – 0.3 to +19.8 V
V
REFL
to AGND – 19.8 to +17.5 V
Operating temperature range – 40 to +105 ° C
Storage temperature range – 65 to +150 ° C
Maximum junction temperature (T
J
max) +150 ° C
Power dissipation (T
J
max - T
A
)/ θ
JA
W
Thermal impedance, θ
JA
TSSOP-16 161.4 C/W
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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