Datasheet

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ABSOLUTE MAXIMUM RATINGS
DAC8811
SLAS411B – NOVEMBER 2004 – REVISED FEBRUARY 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
(1)
MINIMUM
RELATIVE DIFFERENTIAL PACKAGE- SPECIFIED TRANSPORT
ACCURACY NONLINEARITY LEAD TEMPERATURE PACKAGE ORDERING MEDIA,
PRODUCT (LSB) (LSB) (DESIGNATOR) RANGE MARKING NUMBER QUANTITY
DAC8811C ± 1 ± 1 MSOP-8 (DGK) -40 ° C to 85 ° C D11 DAC8811ICDGKT Tape and Reel, 250
DAC8811C ± 1 ± 1 MSOP-8 (DGK) -40 ° C to 85 ° C D11 DAC8811ICDGKR Tape and Reel, 2500
DAC8811C ± 1 ± 1 SON-8 (DRB) -40 ° C to 85 ° C D11 DAC8811ICDRBT Tape and Reel, 250
DAC8811C ± 1 ± 1 SON-8 (DRB) -40 ° C to 85 ° C D11 DAC8811ICDRBR Tape and Reel, 2500
DAC8811B ± 2 ± 1 MSOP-8 (DGK) -40 ° C to 85 ° C D11 DAC8811IBDGKT Tape and Reel, 250
DAC8811B ± 2 ± 1 MSOP-8 (DGK) -40 ° C to 85 ° C D11 DAC8811IBDGKR Tape and Reel, 2500
DAC8811B ± 2 ± 1 SON-8 (DRB) -40 ° C to 85 ° C D11 DAC8811IBDRBT Tape and Reel, 250
DAC8811B ± 2 ± 1 SON-8 (DRB) -40 ° C to 85 ° C D11 DAC8811IBDRBR Tape and Reel, 2500
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com .
over operating free-air temperature range (unless otherwise noted)
(1)
DAC8811 UNIT
V
DD
to GND –0.3 to 7 V
Digital input voltage to GND –0.3 to +V
DD
+ 0.3 V
V (I
OUT
) to GND –0.3 to +V
DD
+ 0.3 V
Operating temperature range –40 to 105 ° C
V
REF
, R
FB
to GND –25 to 25 V
Storage temperature range –65 to 150 ° C
Junction temperature range (T
J
max) 125 ° C
Power dissipation (T
J
max – T
A
) / R
ΘJA
W
Thermal impedance, R
ΘJA
55 ° C/W
Lead temperature, soldering Vapor phase (60s) 215 ° C
Lead temperature, soldering Infrared (15s) 220 ° C
ESD rating, HBM 4000 V
ESD rating, CDM 1000 V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
2
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