Datasheet

DAC8560
SLAS464B –DECEMBER 2006–REVISED NOVEMBER 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING/ORDERING INFORMATION
(1)
MAXIMUM MAXIMUM MAXIMUM
RELATIVE DIFFERENTIAL REFERENCE SPECIFIED
ACCURACY NONLINEARITY DRIFT PACKAGE- PACKAGE TEMPERATURE PACKAGE
PRODUCT (LSB) (LSB) (ppm/°C) LEAD DESIGNATOR RANGE MARKING
DAC8560A ±12 ±1 25
DAC8560B ±8 ±1 25
MSOP-8 DGK –40°C TO +105°C D860
DAC8560C ±12 ±1 5
DAC8560D ±8 ±1 5
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
UNIT
V
DD
to GND –0.3V to 6V
Digital input voltage to GND –0.3V to +V
DD
+ 0.3V
V
OUT
to GND –0.3V to +V
DD
+ 0.3V
Operating temperature range –40°C to +105°C
Storage temperature range –65°C to +150°C
Junction temperature range (T
J
max) +150°C
Power dissipation (DGK) (T
J
max – T
A
)/θ
JA
Thermal impedance, θ
JA
206°C/W
Thermal impedance, θ
JC
44°C/W
Human body model (HBM) 4000V
ESD rating
Charged device model (CDM) 1500V
(1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
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