Datasheet

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2.3 Bill of Materials
PCB Design and Performance
Figure 9. INL and DNL Characteristic Plot
Table 2. Parts List
Item Qty Value Designators Description Vendor Vendor Part Number
1 3 0.1 µ F C1 C3 C7 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216X7R1E104KT
SMD, 25V, ± 15% TC, ±10% Tol
2 2 1 µ F C9 C10 Multilayer Ceramic Chip Capacitor, 1210 TDK C3225X7R1E105KT
SMD, 25V, ± 15% TC, ± 10% Tol
3 1 1 nF C12 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216X7R1H102KT
SMD, 25V, ± 15% TC, ± 10% Tol
4 1 0.47 µ F C2 Multilayer Ceramic Chip Capacitor, 1206 TDK C3216X7R1H474KT
SMD, 50V, ± 15% TC, ± 10% Tol
(1)
5 2 10 µ F C5 C11 Multilayer Ceramic Chip Capacitor, 1210 TDK C3225X7R1E106KT
SMD, 25V, ± 15% TC, ± 10% Tol
6 3 10 k Ω R6 R12 R14 1/8W 1206 Thick Film Chip Resistor, ± 1% Tol Panasonic ERJ-8ENF1002V
(1)
P2, P4, and P6 parts are not shown in the schematic diagram. All the P-designated parts are installed in the bottom side of the
PCB opposite the J-designated counterpart. For example, J2 is installed on the top side whereas P2 is installed on the bottom
side opposite of J2. The following components are not installed: J1, J5, C2, C8, C13, R5, R7, R15, R18, R19, R20, R21,
R22, R23, R24, R25, and U4. The installed U1 device determines the type of EVM.
SLAU172A – December 2005 – Revised September 2006 DAC8550/51/52 Evaluation Module 9
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